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  • In order to consolidate and expand the existing microelectronic research and development in Germany regarding quantum and neuromorphic computing, the FMD launched on December 1, 2022, a joint project together with four other Fraunhofer institutes, the Jülich Forschungszentrum and AMO GmbH: The Research Fab Microelectronics Germany - Module Quantum and Neuromorphic Computing (FMD-QNC). The German Federal Ministry of Education and Research is funding the equipment and structural setup required for the project.

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  • RE-USE research project / 2022

    Recyclable food packaging: quality control for nanocoatings

    Chemnitz / October 12, 2022

    Monomaterials replacing compounds: Today, most packaging is incinerated as waste as it consists of compound materials. Fraunhofer researchers are developing barrier layers that are only several nanometers thin to produce recyclable packaging consisting of monomaterials and increase the recycling rate. To this end, a team at Fraunhofer IPM is developing a process to check the quality of the layers during production.
    © Fraunhofer IPM

    Across the EU, more than 300 billion items of packaging are not recycled every year because they consist of a mixture of different materials. Monomaterial packaging on the other hand is easy to recycle. However, it needs to be coated with ultra-thin barrier layers to protect delicate products just as well as compound materials do. The Fraunhofer team is developing an optical measurement system enabling the inline quality control of these barrier layers.

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  • Maintenance on the “Applied Materials Centura 5200” 200 mm plasma etching tool fully remanufactured and augmented by memsstar. Photo: Fraunhofer ENAS / Cornelia Schubert

    Fraunhofer ENAS and memsstar Limited are partnering. In order to ensure the quality of the reactive ion etching processes in MEMS manufacturing and the throughput Fraunhofer ENAS works now with a fully remanufactured “Applied Materials Centura 5200” 200 mm plasma etching tool.

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  • The annual Smart Systems Integration Conference and Exhibition will be held in Bruges, Belgium, March 28-30, 2023. The conference systematically addresses all system integration aspects. This includes integration of different functionalities, heterointegration, packaging, software integration including firmware as well as reliability and safety aspects. The SSI connects science, industry and politics. It is the platform for networking of the different experts on the one hand from the hardware and software area, on the other hand from the different levels of the products, from system-on-chip over system-in-a-package up to system-of-systems for different application domains. At the same time the apc|m conference takes place in the Bruges conference center. Both conferences have their own profile, but the common venue gives participants the opportunity to exchange ideas on topics of mutual interest and to cross-fertilize.

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  • The Fraunhofer ENAS Research Award for outstanding scientific achievements was presented by Prof. Karla Hiller, Chair of the Research Award Jury, Dr. Sven Zimmermann and the Institute Director Prof. Harald Kuhn. The award winner Dr. Chris Stöckel received the research award for his developments of technologies and devices for piezoelectric microsystems. Photo: Conny Schubert / Fraunhofer ENAS
    © Conny Schubert / Fraunhofer ENAS

    The Fraunhofer Institute for Electronic Nano Systems is a specialist in the development of innovative sensors and actuators as well as their integration into application-oriented systems. The focus of the development lies on systems and novel components based on future-oriented technologies, which significantly expand the state of the art with intelligent system integration and are tailored to the requirements of the respective users. Dr. Chris Stöckel has successfully established a microsystem platform (MEMS platform) based on piezoelectric aluminum nitride and receives the Fraunhofer ENAS Research Award 2021 for this.

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