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The institutes Fraunhofer ISIT, IPMS and ENAS are presenting a pioneering initiative to promote MEMS-based ultrasonic sensor technology at SENSOR+TEST in Nuremberg, Germany. Their one-stop shop offers customized solutions for companies that want to benefit from the advantages of this technology.
more infoSince July 2022, the Research Fab Microelectronics Germany (FMD) and Intel have been collaborating to champion and drive 3D heterogeneous integration R&D in Germany. In a series of technical workshops organized by FMD and Intel Europe Research, experts from FMD, Intel, and German industries have defined their 2030+ research roadmap for 3D heterogeneous integration. Challenges and opportunities have been identified for major application areas such as automotive, industry and high-performance computing establishing the foundation for joint research projects in these critically important areas. This is part of the effort in building a strategic research partnership between FMD and Intel to grow heterogeneous 3D integration capabilities in Germany and in Europe, which is also a key topic of Intel Europe Research engagement in the European R&D ecosystem.
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