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  • Fraunhofer Executive Board confirms continuation of the Micro/Nano Performance Center / 2022

    Technological sovereignty to counter micro-chip shortage: combining expertise in research and development for microelectronics in Saxony

    Chemnitz / April 07, 2022

    The economic consequences of the current chip shortage highlight the importance of microelectronics. In order to prepare for the future, technological sovereignty in microelectronics research and development is required, in addition to new production facilities in Europe. This is precisely the challenge that the High Performance Center "Functional Integration for Micro- /Nanoelectronics" is addressing. It combines the competencies of four microelectronics institutes of the Fraunhofer-Gesellschaft as well as of research groups at universities in Dresden and Chemnitz. This way, the center offers a whole spectrum of microelectronics and micromechanics technologies to both major players in the microelectronics industry and small and medium-sized enterprises (SMEs). SMEs in particular can profit from a low-threshold service through the provision of technology platforms, which allows them to benefit from leading edge technology without the burden of excessively high development cost.

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  • InPrint Munich 2022 and LOPEC 2022 / 2022

    Technologies for the production of printed functionalities on 3D objects

    Chemnitz / March 01, 2022

    Robotergeführter Inkjet-Druck einer Heizleiterstruktur für eine beheizbare Sitzschale: Versuchsstand am Fraunhofer ENAS mit Roboter Yaskawa GP8. (Bild © Fraunhofer ENAS)
    © Fraunhofer ENAS

    The Fraunhofer Institute for Electronic Nano Systems ENAS is presenting various printing technologies for functionalizing 3D objects at this year‘s LOPEC in Munich. Applications range from contacting individual microchips in electronic systems to large-area heating structures for seats. At the booth, the research team will show a robot setup with an integrated print head for inkjet printing and functionalized prototypes.

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  • Presented at the MEMS Sensing & Network System 2022 / 2022

    Inductive bonding – A new bonding method in microsystems technology

    Toyko/Japan / January 28, 2022

    IR image of inductive heating of the multi-chip setup with Ag paste array onto the DBC substrate. The target temperature of 300 °C is reached in only five seconds. Foto  © Fraunhofer ENAS
    © Fraunhofer ENAS

    The Fraunhofer Institute for Electronic Nano Systems ENAS is developing a new bonding technology for microsystems in cooperation with Chemnitz University of Technology and SHINKO ELECTRIC INDUSTRIES CO., LTD. The chip-level inductive bonding process will be presented for the first time at MEMS Sensing & Network System 2022 in Tokyo.

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  • Foto (a) und lichtmikroskopische Aufnahme (b) einer ultra-dünnen flexiblen Parylene-basierten Leiterplatte mit zwei Umverdrahtungsebenen aus Gold. (Foto @ Fraunhofer ENAS)
    © Fraunhofer ENAS

    Scientists at the Fraunhofer Institute for Electronic Nano Systems ENAS in Chemnitz successfully developed and manufactured flexible printed circuit boards with an overall thickness of less than 20 micrometers and several metallization layers based on the polymer Parylene. The institute presents the new generation of flexible PCB this fall at the COMPAMED and the SEMICON Europa 2021.

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  • Chip-integrated optical infrared components / 2021

    Miniature spectrometer for the smartphone

    July 01, 2021

    Recognizing fake drugs? Testing water samples ourselves? Checking the quality of air? In the future, it could be possible to do all this using a smartphone in a quick, cost-effective and straightforward way. The process is being made possible by a spectrometer, weighing just one gram, from the Fraunhofer Institute for Electronic Nano Systems ENAS. The aim is to mass-produce this component for around a euro using conventional technologies.

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  • FRAUNHOFER GROUP FOR MICROELECTRONICS IN COOPERATION WITH LEIBNIZ FBH AND IHP / 2021

    Terahertz technologies for visionary innovations in communications and sensor technology

    June 04, 2021

    In the recently launched joint project "T-KOS" of the Research Fab Microelectronics Germany (FMD), terahertz technology is now to be developed synergistically for industry in the fields of communication and sensor technology for the first time. Innovative system solutions in both areas can make a significant contribution to the successful implementation of future issues such as digitalization, Industry 4.0 or resource efficiency and thus strengthen Germany as a business location in the long term.

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