EU Project EuroPAT-MASIP
The project “European Packaging, Assembly and Test Pilot for Manufacturing of Advanced System-in-Package” will consolidate and extend the European leadership in semiconductor processing know-how and contribute towards keeping Europe at the forefront of the electronics technology development.
More than 90 % of semiconductor packaging, assembly and testing is done outside Europe
The increase in complexity of electronic systems and to System-in-Package (SiP) solutions for IoT modules offers the chance bring back advanced packaging manufacturing to Europe.
Advanced semiconductor packaging needs continuous improvement of the three crucial factors: performance, form factor, and cost / reliability.
Project Goals and Results
Increase in competitiveness and global market share of European semiconductor industry.
Accelerate the manufacturing uptake of new technologies and shorten the time-to-market.
Reinforce smart, sustainable economic growth for Europe and job creation in Europe.
Key Project Characteristics
The project was among the top 3 ranked proposals accepted in the call
Total project budget: 30 M€ - Funding: 7.2 M€ (EU - JTI ECSEL) + 5.5 M€ (National authorities)
28 partners from 9 European countries - Project runtime: 1 April 2017 - 31 March 2020
Fraunhofer ENAS leads the Work Package 'Integration Concepts, Design, Modelling & Simulation'. On the engineering side, we will develop a new strategy for automated virtual prototyping and implement it with a universal scheme based on validated numerical simulations. The method will account for the aspects of manufacturability and reliability right in the design phase. It aims at providing 'right first time' design solutions for all future SiP products based on the fan-out wafer level packaging (FO-WLP) technology according to the NANIUM Packaging Roadmap.