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Fraunhofer Institute for Electronic Nano Systems
Fraunhofer Institute for Electronic Nano Systems
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Outstanding Paper Award of InterPACK 2020
2023-07-27_FMD and Intel join forces to accelerate research
2024-04-23_Best Paper Award SSI
2024-05-30_One-Stop Store for Micromechanical Ultrasound
2024-08-05_Start CCoE
Process modeling
Interview I Hiring of trainees
Interview Trust-E
Interview Macwelt
IVAM Podcast
20240918_PressRelease_TRC
Visit by Vietnamese delegation
reliability tests
HaloFreeEtch
UpFUSE
Cooperation Fraunhofer ENAS & Klinikum Chemnitz
IHK Award
20241124_PressRelease_Innovation Office Regensburg
20241216_PressRelease_APECS
Nanotom
20250116_PressRelease_Eles
Sustainability: Certification
20250227_PressRelease_ThinSiCPower
KoVoPack
20250401_PressRelease_ChipletApplicationHub
Parylene
Jochen Mueller
20250526_Becamex
2025-06-18_PressRelease_OpeningETRC
20250702_VXInstruments
20251104_DelegationMP
20251118_Cooperation Agreement X-FAB
PFAS
20260224_KlinikumChemnitz
DORMO
Ralf Arnold
Events
Chemnitz Seminars
Archive: Chemnitz Seminars
Registration Chemnitz Seminar
Double Opt-in Confirmation
Confirmation of Registration for Chemnitz Seminars
45th Chemnitz Seminar
Chemnitz Seminar Test and Reliability
Chemnitz Seminar One Health
Smart Systems Integration Conference
Smart Systems Integration Conference 2024
Exhibition Series "Science meets Art"
LABORATORY 2025
Ganz aus dem Häuschen
MarcoHabeck
Tilman Hornig
Daniel Krüger
Peter Piek
Fraunhofer Symposia
Archive: Fraunhofer Symposia
14th Fraunhofer Symposium Sendai
15th Fraunhofer Symposium Sendai
Registration Fraunhofer Symposium
Double Opt-in Confirmation
16th Fraunhofer Symposium
Registration Fraunhofer Symposium-exhibitor
Other Events
Archive: Other Events
2023-07-05_Bruker Seminar/Workshop 2023
Vernissage: rēənˈvent / reinvent - Malerei Daniel Krüger
Colloquium "Digital Image and Volume Correlation"
Print heating pipes easily using the inkjet process
PESM 2025
Waferbond 2025
Science meets Art: Peter Piek
Green ICT Connect 2025
Green ICT Camp
Workshop MEMS Technologies & Applications
FIRSTbyFMD
Press Releases
2017-06-28_Leti_and_Fraunhofer
2017-07-05_EU Project EuroPAT-MASIP
2017-08-30_COMPAMED2017_ProjectMIDARDI
2017-09-19_MonitoringSystemElectroplatingSolutions_MSNS2017
2018-03-14_For high-efficient computers using nanoscale biomolecules
2018-04-10_ILA-BerlinAirShow2018
2018-04-12_SSI2018_FinalReport
2018-06-20_MircoProfTL_FRT+FraunhoferENAS_Sensor+Test2018
2018-12-17_FraunhoferENAS_Research_Award_2018
2018_12_17_Tohoku_University
2018_12_17_Minapim_Brasilien
2019-03-28_Globalfoundries, Fraunhofer-Gesellschaft und Next Big Thing gründen Start-up in Dresden
2019_04_23_First Time - Thomas Gessner Award at SSI2019 granted
2019-06-19_Al-Electroplating_SENSOR+TEST2019
2019-06-20_Near-field-measurment_Sensor+Test2019
2019-06-21_AlN-Technology_SENSOR+TEST2019
2019-09-17_GoBeyond4.0
2019-11-07_Memristor Whitepaper
2020-11-05_Project_M3Infekt_FraunhoferENAS
2020-11-12_Pressrelease_Fraunhofer-ENAS-virtualCOMPAMED2020
2020-12-17_PressRelease_ResearchAward2020_FraunhoferENAS
2021-03-22 Fraunhofer ENAS at LOPEC 2021
2021_04_30_Smart Systems Integration
2021-05-03 SENSOR+TEST 2021
2021-05-18 Press Release Fraunhofer Cooperation Ultrasonic Transducer
2021-06-10 Best Paper Award SSI2021
2021-06-04 Press release TKOS FMD
2021-07-01 Press release Miniature spectrometer for the smartphone
2021-11-15_Ultra-thin_flexible_Parylene-based_PCB
2022-01-28_Inductive-Bonding
2022-03-01_InkjetPrinting_LOPEC2022
2022-04-07_Continuation of the Micro/Nano Performance Center
2022-06-28_Fraunhofer ENAS awards development of piezoelectric aluminum nitride MEMS platform with Fraunhofer ENAS Research Award 2021
2022-07-21_Announcement Smart Systems Integration 2023 and Award Winners of the Smart Systems Integration Conference SSI2022 in Grenoble
2022-07-28_Fraunhofer ENAS extends cooperation with memsstar
2022-10-13_Recyclable food packaging: quality control for nanocoatings
2022-11-10_Harald-Kuhn_Chairman-Advisory-Board-IVAM
2022-12-08_Research Fab for quantum and neuromorphic computing: Launch of the Germany-wide cooperation FMD-QNC
2023-07-27_FMD and Intel join forces to accelerate research
2024-05-30_One-Stop Store for Micromechanical Ultrasound
2024-08-05_Start CCoE
Trade Fairs
hy-fcell 2023
MST-Kongress 2023
COMPAMED 2023
SEMICON Europa 2023
Nano Tech / MEMS Sensing and Network System
Smart Systems Integration Conference 2024
Hannover Messe 2024
Sensor+Test 2024
Conferences and Workshops
Conferences and Symposia
Workshops
Archiv Workshops
Workshop - Air Pulses without Pressurized Air
Events
Exhibitions "Science meets Arts"
Archives Events
Honorary Colloquium in Remembrance of Prof. Dr. Thomas Geßner
10 Years Fraunhofer ENAS
10 Years Fraunhofer ENAS - Registration
10 Years Fraunhofer ENAS without registration
News and Events
WinterSchool
Registration confirmation Fraunhofer ENAS Winter School
Double Opt-in Confirmation
Registration Fraunhofer ENAS Winter School
Archives
MEMS Sensing & Network System 2016
SEMICON Europa 2016
COMPAMED 2016
European 3D Summit 2017
Smart Systems Integration 2017
SEMICON China 2017
LOPEC 2017
HANNOVER Messe 2017
SENSOR+TEST 2017
SEMIEXPO Russia 2017
International Paris Air Show 2017
Silicon Saxony Day 2017
MEMS Sensing & Network System 2017
MEMS Engineer Forum 2017
SEMICON Europa 2017
techtextil 2017
productronica 2017
COMPAMED 2017
Agritechnica 2017
European 3D Summit 2018
embedded world 2018
LOPEC 2018
SEMICON China 2018
Smart Systems Integration 2018
HANNOVER MESSE 2018
ILA - Berlin Air Show 2018
SENSOR+TEST 2018
SEMICON West 2018
MEMS Sensing & Network System 2018
COMPAMED 2018
electronica 2018
SEMICON Europa 2018
3D & Systems Summit 2019
Intec 2019
LOPEC 2019
Smart Systems Integration 2019
BioCHIP 2019
Paris Air Show 2019
SENSOR+TEST 2019
SEMICON West 2019
IMTC 2019
MST-Kongress 2019
Agritechnica 2019
SEMCION Europa 2019
COMPAMED 2019
MEMS Sensing & Network System 2020
mtex+ 2020
SENSOR+TEST 2020
MEMS Sensing & Network Systems 2021
MEF 2021
Fraunhofer Solution Days 2020
virtual.COMPAMED 2020
COMPAMED 2021
SEMICON Europa 2021
SENSOR+TEST 2021
LOPEC 2021
MEMS Sensing & Network System 2022
InPrint Munich 2022
LOPEC 2022
Smart Systems Integration 2022
SENSOR+TEST 2022
HANNOVER MESSE 2022
FC³ Fuel Cell Conference Chemnitz
techtextil 2022
ILA Berlin Air Show 2022
Farnborough International Airshow 2022
COMPAMED 2022
SEMICON Europa 2022
MEMS Sensing & Network System 2023
LOPEC 2023
intec 2023
SSI 2023
HANNOVER MESSE 2023
SENSOR+TEST 2023
LASER World of PHOTONICS 2023
Contact / Directions
[X]
Contact / Directions
Management of the Institute
Dr. Stefanie Zimmermann
Prof. Dr. Harald Kuhn
Prof. Dr. Harald Kuhn
Franziska Gassenbauer
Business Units
Process, Device and Packaging Technologies
Dr. Jochen Müller
Dr. Jörg Schuster
Dr. Danny Reuter
Prof. Dr. Karla Hiller
Dr. Maik Wiemer
Dr. Sascha_Hermann
Birgit Weber
Mareen Bunar
Yvonne Ostmeier-Ullmann
Smart Systems
Dr. Roman Forke
Andreas Morschhauser
Dr. Jörg Martin
Dr. Christan Hedayat
Dr. Alexander Weiß
Dr. Mario Baum
Prof. Dr. Ralf Zichner
Annika Göhring
Marlen Eschrich
Test and Reliability Solutions
Dr. Mario Braun
Alissa Hölzl
Dr. Diana Maier
Harald Kuhn
Dr. Jan Langer
"Reliability"
Stefanie Glöckner
European Test and Reliability Center
Corporate Strategy
Dr. Steffen Kurth
Dr. Christian Irmscher
Alexander Schade
Heiko Maier
International Sales
Rainer Kaltschmidt
Benjamin Schreiber
Bianca Milde
Wolfgang Bohrer
Infrastructure and Fab Management
Dr. Ramona Ecke
Thomas Ronneburger
Michael Schubert
Ombudsman
Direction Paderborn
Direction Fraunhofer ENAS Chemnitz
Institute
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Institute
Profile
Board of trustees
Cooperations
Cooperation within Fraunhofer-Gesellschaft
Cooperation with universities
Networks
Research Fab Microlectronics Germany
APECS
European Test and Reliability Center
Portfolio of Services and Testing Infrastructure
Electromagnetic Near-Field Measurement Techniques
Industry Solutions
Organization Chart
Management Systems
Quality Policy
Mission and Vision
Guiding Principles of Fraunhofer ENAS
Energy Policy
Data and Facts
The Institute in Numbers
History
Business Units
[X]
Business Units
Process, Device and Packaging Technologies
Simulation
Simulation of devices
Simulation of processes
Technologies and Processes
Lithography for MEMS, NEMS and Nanodevices
CVD-, ALD- und High-Temperature Processes
Plasma Etching and Process Diagnostics
3D/MEMS Packaging
Wafer-to-Wafer-Bonding
Characterization of Bonding
3D Integration
Parylene Based Packaging
Interconnect
Chip-to-Wafer and Chip-to-Chip bonding
MEMS Technology Platforms
Piezoelectric Microsystems
Bonding and Deep RIE
Airgap insulated microstructures
Bulk Micromachining
Membrane based devices
Nanotechnological Components and Systems
Platform for 1D/2D Nanostructures
1D/2D Nanodevices
Heterogeneous Integration of Nanodevices
Spintronic Devices
Optical Nano Structures
Memristive Devices
Nanotechnological Components and Systems
Smart Systems
Inertial Components and Systems
Acceleration Sensors
Vibration Sensors
High Precision MEMS Angular Rate Sensor
Optical Components and Systems
Spectral Components
Sensor and Imaging Systems
Service: Material and Surface Characterization
Hybrid and Wireless Sensors and Systems
Wireless multi-sensor systems
Wireless Power Transfer
Hybrid Sensors and Actuators
RF Components and Systems
RF MEMS Switch
RF MEMS characterization
Acoustic Components
CMUT - Capacitive Micromechanical Ultrasonic Transducer
PMUT – A new generation of ultrasonic transducers
Printed Functionalities
Printed, flexible and hybrid electronics
Roll-to-roll printing machines, sheet format and printing on 3D objects
Printed Catalyst Coated Membrane (CCM) / MEA for their application in fuel cells and electrolyzers
Medical Systems and Smart Health
Microfluidic for Lab-on-Chip Systems
Theranostic Implants
Endostim
Devices for NeuroControl and NeuroRehabilitation (DeNeCor)
Project Apfel
M³Infekt
beforeFever
Test and Reliability Solutions
Reliability
Lifetime Test and Modeling
Characterization and Analytics
Reliability of Components and Systems
Data-based Methods
Acceleration through AI
Sensor-based data fusion
Demonstrator: Digital Twin Chemical Mechanical Polishing (CMP)
Integratable Spectral Sensing in Multi-Reactor Technology - Result Interpretation Using Neural Networks
AI-Supported Development of Electronic Systems for Future Vehicle Generations in the progressivKI Project
Implementation of a Novel Magnetic Field-Based Location Method Using AI
AI-based Image Analysis
Cross-Functional Topics
FAB Management
Inline Metrology and Data
Corporate Strategy
International Sales
NFS
Printed Electronics
Research focus
[X]
Research focus
Design, Simulation and Digital Models
Wafer Processes
Wafer-Level Packaging and Heterogeneous Integration
Smart System Integration
Testing, Characterization, Reliability
Projects
[X]
Projects
Print4POC+
DORMO
NewLPCVD
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Downloads
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Contact / Directions
Business Units
Process, Device and Packaging Technologies
"Process, Device and Packaging Technologies"
Business Unit Management
Dr. Jochen Müller
Head
Dr. Jochen Müller
Birgit Weber
Assistance
Birgit Weber
Mareen Bunar
Assistance
Mareen Bunar
Yvonne Ostmeier-Ullmann
Assistance
Yvonne Ostmeier-Ullmann
Experts
Dr. Jörg Schuster
"Simulation"
Dr. Jörg Schuster
Dr. Danny Reuter
"Technologies and Processes"
Dr. Danny Reuter
Dr. Maik Wiemer
"3D/MEMS Packaging"
Dr. Maik Wiemer
Prof. Dr. Karla Hiller
"MEMS Technology Platforms"
Prof. Dr. Karla Hiller
Dr. Sascha Hermann
"Nanotechnological Components and Systems"
Dr. Sascha Hermann
Fraunhofer Institute for Electronic Nano Systems