The business unit Process, Device and Packaging Technologies bundles all processes of clean room technologies (micro- and nanotechnologies) at Fraunhofer ENAS in close cooperation with the Center for Microtechnologies at the Chemnitz University of Technology. Thus, it comprises the individual processes and technologies as a basis for the development of electronic components, sensors and actuators, including their packaging (MEMS, wafer-level packaging and heterointegration of different components). This is complemented by the simulation of processes, equipment, materials and components of micro- and nanoelectronics.
The aim of research and development is in particular the implementation of new materials and functional principles on the micro- and nanoscale and the process technology required for this.
The business unit focuses on the following topics:
- Modeling and simulation of technological processes and devices.
- Micro- and nanotechnological processes
- 3D / MEMS Packaging
- MEMS technology platforms
- Nanotechnology components and systems