In addition to administration and quality management, the staff includes the areas of infrastructure, FAB management, marketing, corporate strategy, and international sales.
The business unit "Process, Device and Packaging Technologies" combines the departments "Nano Device Technologies" (NDT), "System Packaging" (SP), and "Simulation of Semiconductor Technology" (SST).
The business unit "Smart Systems" includes the departments "Multi Device Integration" (MDI), "Smart Wireless Systems" (SWS), "Health Systems" (HS), and "Printed Functionalities" (PF).
The business unit "Test and Reliability Solutions" comprises the departments "Micro Material Center" (MMC) and "Test, Methods and Systems" (TMS).