Fraunhofer Institute for Electronic Nano SystemsEuroPAT-MASIP project team from Fraunhofer ENAS, Besi NL and Amkor has been awarded with the Outstanding Paper Award at ASME 2020 InterPACK Conference (Oct 27 – 28, 2020) for their paper »The Systematic study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods«.
Congratulations to Ghanshyam Gadhiya, Sven Rzepka, Thomas Otto, Sebastiaan Kersjes and Felandorio Fernandes!
The paper focuses on characterizing the physics of wafer warpage, which is a challenge for many process steps in fan-out wafer-level packaging (FoWLP) technologies used for heterogeneous system integration. The new study provides recommendations and good practical guidance for improving the design and optimizing the process flow of FoWLP solutions with increased product yield and reliability.
