Fraunhofer Institute for Electronic Nano Systems
Since July 2022, the Research Fab Microelectronics Germany (FMD) and Intel have been collaborating to champion and drive 3D heterogeneous integration R&D in Germany. In a series of technical workshops organized by FMD and Intel Europe Research, experts from FMD, Intel, and German industries have defined their 2030+ research roadmap for 3D heterogeneous integration. Challenges and opportunities have been identified for major application areas such as automotive, industry and high-performance computing establishing the foundation for joint research projects in these critically important areas. This is part of the effort in building a strategic research partnership between FMD and Intel to grow heterogeneous 3D integration capabilities in Germany and in Europe, which is also a key topic of Intel Europe Research engagement in the European R&D ecosystem.
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