Downloads

Welcome to the download area of the Fraunhofer-Institute for Electronic Nano Systems ENAS. Here you can download data sheets about the products and applications of Fraunhofer ENAS, information brochures about the institution as well as the annual report as pdf files.

On this page you can download data sheets from the Fraunhofer ENAS which address the topics sensor / actuators and systems, technology and testing. All information contained in the datasheets are preliminary and subject to change. Furthermore, the described systems, materials and processes are not commercial products. These are prototypes which can be further developed by Fraunhofer ENAS on customer request.

Components

inertial sensors  
High precision +/- 10° inclination sensor Download
energy supply  
Printed Thin Film Battery Download
Printed Thin Film Battery (Japanese) Download
Smart universal power antennas for wireless energy transmission Download
communication  
Printed Antennas Download
Printed Antennas (Japanese) Download

Systems

Miniaturized NIR/MIR-Spectrometer  Download
Miniaturized NIR/MIR-Spectrometer (Japanese) Download
Miniaturized turnable Band-Pass fllters for the infrared spectral range Download
Sensor Integration with Autarkic Power Supply into a Simmering Download
Grease Sensor for Condition Monitoring of Rolling Bearings Download
ASTROSE - Autarkic Sensor Network for Condition Monitoring of Power Lines Download
Fully-integrated microfluidic cartridges for in-vitro diagnostics Download

Simulation

Process and equipment simulation of chemical vapor deposition  Download
Device simulations for semiconductor industry and photovoltaics Download
Simulation of sputter deposition Download

System Integration & Packaging

bonding  
Direct Bonding using chemical reactive plasma discharge Download
Direct Bonding using chemical reactive plasma discharge (Japanese) Download
Reactive bonding by using multi nano layer systems Download
Reactive bonding by using multi nano layer systems (Japanese) Download
Thermocompression wafer bonding with thin metal layers Download
Thermocompression wafer bonding with thin metal layers (Japanese) Download
Solid-liquid interdiffusion bonding (SLID) at wafer level Download
Solid-liquid interdiffusion bonding (SLID) at wafer level (Japanese) Download
Semi-finished bonded substrates Download
Semi-finished bonded substrates consisting of photosensitive Foturan and Borofloat 33 Download
Semi-finished bonden substrates consisting of piezo- and pyroelectric lithium tantalate and glass Download
Semi-finished bonded substrates: Silicon on glass (SOG) Download
Semi-finished bonded substrates consisting of lithium tantalate and Silicon Download
Semi-finished bonded substrates: SOI-Wafer (Silicon on insulator) Download
3D Integration  
3D Integration: TSV processes and wafer thinning Download
3D Integration: TSV processes and wafer thinning (Japanese) Download
Silicon Interposer for 3D sensor systems Download
further technologies  
Screen Printing for MEMS Packaging and Wafer bonding Download
Aerosol Jet Printing Download
Aerosol Jet Printing (Japanese) Download
characterization  
Hermeticity characterization of packaged micro chips Download
Mechanical characterization of the bonding strength Download
Scanning Acoustic Microscopy Download

Technologies

Nanoimprint Lithography Download
Atomic Layer Deposition and targeted application areas Download
Atomic Layer Deposition and targeted application areas (Japanese) Download
Integration of Carbon Nanotubes and Applications Download
Integration of Carbon Nanotubes and Applications (Japanese) Download
Electro Chemical Deposition from Ionic Liquids Download

Test procedure

MEMS Parameter Identifikation Download