Grenoble/France  /  01/23/2017  -  01/25/2017

Creating High Density Systems

European 3D Summit 2017

booth no 7 and 8
joint booth with Fraunhofer IZM and IKTS

Printed non planar silver nanoparticle-based chip-2-board interconnects for the 3D integrated system in a package (triple stacking of ASIC, acceleration sensor, powerdown interrupt generator) are fabricated using Aerosol Jet technology and silver nanoparticle ink.
© Fraunhofer ENAS

Printed non planar silver nanoparticle-based chip-2-board interconnects for the 3D integrated system in a package (triple stacking of ASIC, acceleration sensor, powerdown interrupt generator) are fabricated using Aerosol Jet technology and silver nanoparticle ink.

This year’s 5th edition of European 3D Summit willn open its doors in Grenoble/France from January 23 to 25, 2017. SEMI invites experts in 3D integration under the topic "Creating High Density Systems". They focus on a wide scope of 3D topics including 3DIC Through-Silicon-Via (TSV) technology and its challenges, but also 2.5D, 3D FO-WLP/ e-WLB, Glass interposers, and 3D alternative technologies in order to create Heterogeneous Integration and High Density Systems for different applications.

Fraunhofer ENAS will show different samples of MEMS with integrated TSV as well as interposer technologies and printed interconnects. The institut also inform about its R&D and service offers for bonding technologies and packaging.