Fraunhofer Institute for Electronic Nano Systems
Fraunhofer Institute for Electronic Nano Systems
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    • Micro and Nanoelectronics
      • Processes and Technologies for Micro and Nanoelectronics
        • In situ plasma diagnostics for 7 nm etching processes
        • Chemical Vapor Deposition of Cobalt Oxides at Low Temperatures
        • Thermal ALD of metallic copper on cobalt for advanced interconnects
        • Investigation of ULK etching processes by using plasma diagnostic and correlation analytics
        • Experimental and theoretical investigations on a plasma assisted in situ restoration process for ULK dielectrics
        • Characterization of Copper Alloys for Self-Forming Barrier Applications
      • Modeling and simulation of technological processes, equipment and devices
        • Simulation of devices
        • Simulation of processes and equipment
        • Modeling and simulation methods for efficient and full system characterization
      • Beyond CMOS and RF devices
        • Memristors for the computers of tomorrow
        • Functional Nano Structures for Biocomputing
        • RF MEMS Switch
        • Non-volatile, reconfigurable resistance switches
        • Technology development for analog high-frequency CNT-FETs
      • Packaging and (heterogeneous) integration
        • Power Packaging – Silver and Copper/Tin Sintering for power Electronics
        • Tamper respondent envelope solutions realized by additive manufacturing – Smart Packaging Solutions for Secure Applications
        • HyperConnect: Self-assembly of micro and nanoparticles by centrifugal forces and capillary bridging for 3D thermal interconnects
        • Cool PoD: Printed 3D chip-2-board interconnects
        • Materials and Technologies to Enable High-Temperature Stable MEMS and Electronics
      • Electromagnetic and thermomechanic characterization and reliability evaluation
        • Thermo-mechanical reliability aspects of high temperature interconnects by transient liquid phase soldering
        • Multiscale residual stress analysis in thin film layers
        • High-precision deformation measurements in multi-scale applications – a verification methodology for simulation-based reliability predictions
        • Measurement of Intrinsic Stresses Using FIB Equipment Becomes a Method of Regular Industrial Practice
        • Long-term Reliability Testing Under Field Conditions and Evaluation of Acceleration Factors
        • Reliability optimization for the next generation of LED-based smart and comfortable lighting solutions
        • Systemic and long-term effects on the reliability of soldered joints for future mobility
        • Parameter identification by Nanoindenter
        • New Simulation Approach: Reliability Analysis applying CZM for 3D Packages
      • More informations are comming soon
    • Sensor and Actuator Systems
      • Inertial sensors
        • Intense2020 – Development of robust Acceleration sensors for automotive applications
        • High-Performance MEMS Gyroscope
        • Aluminum nitride – Innovative piezoelectric MEMS transducer
        • Cu-TSV for MEMS based on a Via Last approach
        • Temporary wafer bonding for MEMS devices
        • Direct integration of strain sensitive field effect transistors for NEMS
        • Piezoelectric low-power MEMS with aluminum nitride
        • Thermo-mechanic excitation of encapsulated MEMS components
      • Optical systems/MOEMS
        • FABRY-PÉROT Interferometer for sensor applications in the infrared spectral range on their way to further miniaturization
        • MEMS components with subwavelength structures for infrared applications
        • Carbon nanotube (CNT) films as black body absorber or emitter for IR applications
      • Electromagnetic sensors
        • Near Field Electromagnetic Sensors
        • Monolithically integrated 2D magnetic field sensors based on GMR spin valves
        • XMR Sensor Operating at MHz Sampling Rates
      • Pressure and power transducer
        • PMUT – A new generation of ultrasonic transducers
      • Material and structure sensors
        • Light-emitting Diodes based on Quantum Dots for Integration in plastic material
        • Mechanical load detection for lightweight materials
        • Metamaterials – Possibilities for the Realization of passive acting smart structures
        • Carbon nanotube giant piezoresistive strain sensors
      • Reliability
        • TSV Reliability
        • In Situ Stress Monitoring using a stress chip
        • UNSETH: Process and Reliability Assessments of Integration and Packaging Technologies Providing Hardware-based Security
      • More informations are comming soon
    • Technologies and Systems for Smart Power ans Mobility
      • Network Monitoring
        • Algorithms for the monitoring system ASTROSE® for increasing the current carrying capacity of overhead power lines
        • Partial discharge sensor using an immersed MEMS transducer
        • ISOSTROSE – Localization of ground faults on 110 kV o verhead powerlines with a wireless sensor system mounted at the conductor
        • Reliable thermo-mechanical design of high voltage planar technology solutions for smart wind power modules
        • Remote Ice Detection by Printed Resonator Arrays for Rotor Blades of Wind Power Plants
        • ‘Design for Reliability’ in Power Electronics with New Interconnection Technologies for Future Smart Mobility and Smart Energy Solutions
        • Autonomous sensor network for condition monitoring of high voltage power lines (ASTROSE)
      • Energy supply of mobile devices
        • Transfer of Quantum Dot-sensitized solar cells onto technical textiles
        • Flexible, printed thin film batteries with increased discharge current
      • Improvement of aerodynamic conditions (vehicles and wind power plants)
        • Project: Clean Sky 2
        • Project: TOpWind
        • AFLoNext / CleanSky 2
        • Metamaterials – Possibilities for the Realization of passive acting smart structures
        • ‘Design for Reliability’ in Power Electronics with New Interconnection Technologies for Future Smart Mobility and Smart Energy Solutions
      • Reliability of power electronics/modules in electric cars
        • Active And passive thermal cycles for automotive applications
        • ‘Design for Reliability’ in Power Electronics with New Interconnection Technologies for Future Smart Mobility and Smart Energy Solutions
        • Reliability Assessment and Optimization of a Smart Drive Unit
        • Project TRACE – Technology Readiness for Consumer Electronics Use in Automotive Applications
        • Profile optimization of Multilayer PCBs in Simulation and Deformation measurement
      • More informations are comming soon
    • Technologies and Systems for Smart Health
      • Implants
        • MAVO bioElektron
        • Theranostic Implants
        • WIRAplant: Wireless Active Implants
      • Medical Devices
        • Endostim
        • Project leiTEX: Printed energy storage for wireless evaluable sensor label
        • Devices for NeuroControl and NeuroRehabilitation (DeNeCor)
        • VIAMOS – Vertically Integrated Array-type Mirau-based OCT System for early diagnostics of skin pathologies
      • Measurement Technology and Analytics
        • Piezoelectric micro sensors for Oct applications
        • Project: MOLOKO – Novel rapid tests for food quality and animal health
        • Project: MIDARDI – for a better treatment of diabetic foot ulcer
        • Mobile pathogen analysis for the reduction of broadband antibiotics
        • Sens-o-Spheres
        • Development of a mobile diagnostic platform for the use on self-contained, exploration rovers within harsh environments
        • Tunable band-pass filters for infrared light
        • Capillary microfluidic chip with integrated pump and valve actuator
      • More informations are comming soon
    • Technologies and Systems for Smart Production
      • Smart digital production
        • Digital Manufacturing in Mass Production – Functional Printing on 3D Objects
        • Thermo-mechanical reliability aspects of printed functionalities
        • Project: SAMPL
        • Printing technologies for the integration of electronic functionalities
        • Digital Roll-to-Product Manufacturing of Flexible Printed Smart Systems
        • Digital manufacturing in mass production
      • Sensor Systems for Process and condition Monitoring
        • Structure-integrated wireless sensor and actuator technology for manufacturing systems (SdSeMa)
        • Printed highly-sensitive composite humidity sensors
        • Implementation of zero-power sensors with sensory metamaterials for applications in lightweight structural engineering
        • Active Workpiece Carrier
        • Wireless sensor systems for flexible design of production processes
        • Functional Safety
        • Optical monitoring system for quality control of electroplating solutions
        • Wireless sensor system for measuring of adhesive temperatures
        • Wireless sensor system for structural health monitoring
        • Intelligent industrial drive and flexible manufacturing based on workpiece data and sensor information
        • Oxygen measurement by cavity-enhanced mm-wave spectroscopy
        • Printed antennas on cardboard boxes enabling identification of metal objects in supply chains
      • More informations are comming soon
      • More informations are comming soon_B
    • More information are comming soon.
  • Departments
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    • Multi Device Integration
      • Main Focus of Research
        • Microfluidic Systemintegration
        • Sensor Integration
        • Optical Systems
        • New Materials
        • Parametertest
        • RF MEMS
        • Electronics Design
        • High Perfomance MEMS
      • Services
        • MEMS Design
        • Spectroscopy
        • RF MEMS Characterization
        • MEMS Analysis Service
        • Laser Micromachining
    • Micro Materials Center
      • More informations are comming soon.
    • Printed Functionalities
    • Back-End of Line
    • Department System Packaging
      • Department System Packaging - Research Fields
        • Wafer-to-Wafer Bonding
        • 3D/MEMS Packaging
        • Biocompatible Packaging
        • Printing Technologies
        • MEMS applications
        • Characterization of bonding
        • Electrochemical deposition of special materials
        • Nanoimprint Lithography
        • Parylene based packaging
      • Department System Packaging - Services
    • Advanced System Engineering
      • Research Fields
        • Design of Electrical and Multi-Physical Systems
        • Wireless Sensor Systems
        • Wireless Energy Supply
        • Electromagnetic Near-Field Measurement Techniques
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      • 2017-06-28_Leti_and_Fraunhofer
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      • 2018-03-14_For high-efficient computers using nanoscale biomolecules
      • 2018-04-10_ILA-BerlinAirShow2018
      • 2018-04-12_SSI2018_FinalReport
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      • 2019-03-28_Globalfoundries, Fraunhofer-Gesellschaft und Next Big Thing gründen Start-up in Dresden
      • 2019_04_23_First Time - Thomas Gessner Award at SSI2019 granted
      • 2019-06-19_Al-Electroplating_SENSOR+TEST2019
      • 2019-06-20_Near-field-measurment_Sensor+Test2019
      • 2019-06-21_AlN-Technology_SENSOR+TEST2019
      • 2019-06-17_GoBeyond4.0
      • 2019-11-07_Memristor Whitepaper
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    • European 3D Summit 2018

    European 3D Summit 2018

    Dresden, Germany  /  01/22/2018  -  01/24/2018

    European 3D Summit

    Heterogeneous Integration driving 3D

    European 3D Summit

    www.semi.org/eu/european-3d-summit-2018

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    Source: Fraunhofer-Gesellschaft
    Fraunhofer Institute for Electronic Nano Systems - European 3D Summit 2018

    Online in Internet; URL: https://www.enas.fraunhofer.de/en/news_events/archives/european-3d-summit-2018.html

    Date: 29.3.2020 00:38