Fraunhofer Institute for Electronic Nano Systems
Fraunhofer Institute for Electronic Nano Systems
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      • 2017-06-28_Leti_and_Fraunhofer
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      • 2019_04_23_First Time - Thomas Gessner Award at SSI2019 granted
      • 2019-06-19_Al-Electroplating_SENSOR+TEST2019
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    • Micro and Nanoelectronics
      • Processes and Technologies for Micro and Nanoelectronics
        • In situ plasma diagnostics for 7 nm etching processes
        • Chemical Vapor Deposition of Cobalt Oxides at Low Temperatures
        • Thermal ALD of metallic copper on cobalt for advanced interconnects
        • Investigation of ULK etching processes by using plasma diagnostic and correlation analytics
        • Experimental and theoretical investigations on a plasma assisted in situ restoration process for ULK dielectrics
        • Characterization of Copper Alloys for Self-Forming Barrier Applications
        • New Characterization Opportunities for Surface Processing
      • Modeling and simulation of technological processes, equipment and devices
        • Simulation of devices
        • Simulation of processes and equipment
        • Modeling and simulation methods for efficient and full system characterization
      • Beyond CMOS and RF devices
        • Memristors for the computers of tomorrow
        • Functional Nano Structures for Biocomputing
        • RF MEMS Switch
        • Non-volatile, reconfigurable resistance switches
        • Technology development for analog high-frequency CNT-FETs
        • Technology Platform for Carbon Nanotube Devices
        • Resistive switching in ferroelectric, polycrystalline YMnO3 thin films
        • Demonstration on the Fabrication of Biocomputational Devices
      • Packaging and (heterogeneous) integration
        • Power Packaging – Silver and Copper/Tin Sintering for power Electronics
        • Tamper respondent envelope solutions realized by additive manufacturing – Smart Packaging Solutions for Secure Applications
        • HyperConnect: Self-assembly of micro and nanoparticles by centrifugal forces and capillary bridging for 3D thermal interconnects
        • Cool PoD: Printed 3D chip-2-board interconnects
        • Materials and Technologies to Enable High-Temperature Stable MEMS and Electronics
      • Electromagnetic and thermomechanic characterization and reliability evaluation
        • Thermo-mechanical reliability aspects of high temperature interconnects by transient liquid phase soldering
        • Multiscale residual stress analysis in thin film layers
        • High-precision deformation measurements in multi-scale applications – a verification methodology for simulation-based reliability predictions
        • Measurement of Intrinsic Stresses Using FIB Equipment Becomes a Method of Regular Industrial Practice
        • Long-term Reliability Testing Under Field Conditions and Evaluation of Acceleration Factors
        • Reliability optimization for the next generation of LED-based smart and comfortable lighting solutions
        • Systemic and long-term effects on the reliability of soldered joints for future mobility
        • Parameter identification by Nanoindenter
        • New Simulation Approach: Reliability Analysis applying CZM for 3D Packages
        • Combined experimental-numerical methods for thermo-mechanical system reliability
        • Reliability optimization of innovative design techniques of power electronic systems
        • New possibilities for lifetime testing
        • Automatized Measurement of Micromagnets on Wafer-Level in Close Distance
      • More informations are comming soon
    • Sensor and Actuator Systems
      • Inertial sensors
        • Intense2020 – Development of robust Acceleration sensors for automotive applications
        • High-Performance MEMS Gyroscope
        • Aluminum nitride – Innovative piezoelectric MEMS transducer
        • Direct integration of strain sensitive field effect transistors for NEMS
        • Piezoelectric low-power MEMS with aluminum nitride
        • KoliBriS – Modular technology platform for highly compact inertial sensors with integrated circuit electronics
        • Fluid Sensor
        • Gyrocompass
        • Aluminum nitride piezoelectric micromachined ultrasonic transducers
      • Optical systems/MOEMS
        • FABRY-PÉROT Interferometer for sensor applications in the infrared spectral range on their way to further miniaturization
        • MEMS components with subwavelength structures for infrared applications
        • Carbon nanotube (CNT) films as black body absorber or emitter for IR applications
        • Quantum Dot-based light emitting diodes on textiles
        • Fluorescence Spectroscopy
        • Platform for chip-integrated optical IR components
      • Electromagnetic sensors
        • Near Field Electromagnetic Sensors
        • Monolithically integrated 2D magnetic field sensors based on GMR spin valves
        • XMR Sensor Operating at MHz Sampling Rates
        • Spintronic Sensors for Magnetic Microbeads Detection
        • Spintronics: Laser Annealing for Local Crystallization of TMR Sensors
      • Pressure and power transducer
        • PMUT – A new generation of ultrasonic transducers
        • CNT based force sensors: Process Monitoring in forming tools
      • Material and structure sensors
        • Light-emitting Diodes based on Quantum Dots for Integration in plastic material
        • Mechanical load detection for lightweight materials
        • Metamaterials – Possibilities for the Realization of passive acting smart structures
        • Carbon nanotube giant piezoresistive strain sensors
      • Packaging and (heterogeneous) integration (2D, 2.5D, 3D)
        • Temporary wafer bonding for MEMS devices
        • Cu-TSV for MEMS based on a Via Last approach
        • Electro chemical deposition of integrated reactive Pd/Sn multilayer systems
      • Reliability
        • TSV Reliability
        • In Situ Stress Monitoring using a stress chip
        • UNSETH: Process and Reliability Assessments of Integration and Packaging Technologies Providing Hardware-based Security
        • Automated Virtual Prototyping of reconfigured FOWLP wafers
        • Thermo-mechanic excitation of encapsulated MEMS components
        • Virtual Prototyping for fast design of universal sensor platforms
        • On-line stress measurement during manufacturing and in field-testing with the stress chip
      • More informations are comming soon
    • Technologies and Systems for Smart Power and Mobility
      • Network Monitoring
        • Algorithms for the monitoring system ASTROSE® for increasing the current carrying capacity of overhead power lines
        • Partial discharge sensor using an immersed MEMS transducer
        • ISOSTROSE – Localization of ground faults on 110 kV o verhead powerlines with a wireless sensor system mounted at the conductor
        • Reliable thermo-mechanical design of high voltage planar technology solutions for smart wind power modules
        • Remote Ice Detection by Printed Resonator Arrays for Rotor Blades of Wind Power Plants
        • ‘Design for Reliability’ in Power Electronics with New Interconnection Technologies for Future Smart Mobility and Smart Energy Solutions
        • Autonomous sensor network for condition monitoring of high voltage power lines (ASTROSE)
      • Energy supply of mobile devices
        • Transfer of Quantum Dot-sensitized solar cells onto technical textiles
        • Flexible, printed thin film batteries with increased discharge current
      • Improvement of aerodynamic conditions (vehicles and wind power plants)
        • Project: Clean Sky 2
        • Project: TOpWind
        • AFLoNext / CleanSky 2
        • Metamaterials – Possibilities for the Realization of passive acting smart structures
        • ‘Design for Reliability’ in Power Electronics with New Interconnection Technologies for Future Smart Mobility and Smart Energy Solutions
      • Reliability of power electronics/modules in electric cars
        • Active And passive thermal cycles for automotive applications
        • ‘Design for Reliability’ in Power Electronics with New Interconnection Technologies for Future Smart Mobility and Smart Energy Solutions
        • Reliability Assessment and Optimization of a Smart Drive Unit
        • Project TRACE – Technology Readiness for Consumer Electronics Use in Automotive Applications
        • Profile optimization of Multilayer PCBs in Simulation and Deformation measurement
        • Optical in situ analysis of power electronic devices under power cycling conditions
        • »Design for Reliability« in Radio Frequency Electronics with alternative Interconnection Technologies for Future Smart Mobility
      • More informations are comming soon
    • Technologies and Systems for Smart Health
      • Implants
        • MAVO bioElektron
        • Theranostic Implants
        • WIRAplant: Wireless Active Implants
      • Medical Devices
        • Endostim
        • Project leiTEX: Printed energy storage for wireless evaluable sensor label
        • Devices for NeuroControl and NeuroRehabilitation (DeNeCor)
        • VIAMOS – Vertically Integrated Array-type Mirau-based OCT System for early diagnostics of skin pathologies
        • Project Apfel
      • Measurement Technology and Analytics
        • Optical Systems
        • Microfluidics
        • Environment and agriculture
      • More informations are comming soon
      • Fraunhofer vs. Corona
        • M³Infekt
        • beforeFever
    • Technologies and Systems for Smart Production
      • Smart digital production
        • Digital Manufacturing in Mass Production – Functional Printing on 3D Objects
        • Thermo-mechanical reliability aspects of printed functionalities
        • Project: SAMPL
        • Printing technologies for the integration of electronic functionalities
        • Digital Roll-to-Product Manufacturing of Flexible Printed Smart Systems
        • Digital manufacturing in mass production
        • On-line monitoring of the micro welding process of Si parts in MEMS
        • Product customization in mass production – Printing of wiring harness segments on interior and exterior components
        • MAMA-MEA – Mass Manufacture of MEAs using high-speed deposition processes
        • DigiMan: Development of an R2R Printed and Hybrid Sensor System
        • »GoBeyond4.0«: Increase of Manufacturing Process Stability and Reliability of Printed Systems
      • Sensor Systems for Process and condition Monitoring
        • Wireless Sensor Systems
        • Novel Components
        • Artificial Intelligence
      • More informations are comming soon
      • More informations are comming soon_B
    • More information are comming soon.
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    • Multi Device Integration
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        • MEMS Design
        • Spectroscopy
        • RF MEMS Characterization
        • MEMS Analysis Service
        • Laser Micromachining
    • Micro Materials Center
      • More informations are comming soon.
    • Printed Functionalities
    • Nano Device Technologies
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        • Materials and Metallization for NEMS
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    • System Packaging
      • Department System Packaging - Research Fields
        • Wafer-to-Wafer Bonding
        • 3D/MEMS Packaging
        • Biocompatible Packaging
        • Printing Technologies
        • MEMS applications
        • Characterization of bonding
        • Nanoimprint Lithography
        • Parylene based packaging
        • Electrochemical deposition of special materials
      • Department System Packaging - Services
    • Advanced System Engineering
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        • Design of Electrical and Multi-Physical Systems
        • Wireless Sensor Systems
        • Wireless Energy Supply
        • Electromagnetic Near-Field Measurement Techniques
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    • European 3D Summit 2018

    European 3D Summit 2018

    Dresden, Germany  /  January 22, 2018  -  January 24, 2018

    European 3D Summit

    Heterogeneous Integration driving 3D

    European 3D Summit

    www.semi.org/eu/european-3d-summit-2018

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    Source: Fraunhofer-Gesellschaft
    Fraunhofer Institute for Electronic Nano Systems - European 3D Summit 2018

    Online in Internet; URL: https://www.enas.fraunhofer.de/en/news_events/archives/european-3d-summit-2018.html

    Date: 18.6.2021 15:41