Fraunhofer Institute for Electronic Nano Systems
Fraunhofer Institute for Electronic Nano Systems
  • Career
  • News and Events
  • Contact / Directions
  • Sitemap
  • Deutsch
  • Institute
    [X] Institute
    • Profile
    • Director
    • Advisory Board
    • Data and Facts
    • Organization Chart
    • Cooperations
      • Membership in strategic networks
      • Cooperation with industry
        • Cooperation with industry within the German leading-edge clusters program
      • Cooperation with universities and research institutes
        • Cooperation within the clusters of excellence
        • Cooperation within the Fraunhofer-Gesellschaft
      • Fraunhofer ENAS part of Fab Microelectronics Germany (FMD)
      • High-Performance Center
      • Cooperation within Fraunhofer-Gesellschaft
        • Lighthouse projects
    • Quality Management
      • Quality Policy
      • Vision and Mission
  • Business Units
    [X] Business Units
    • Micro and Nanoelectronics
      • More informations are comming soon
    • Sensor and Actuator Systems
      • More informations are comming soon
    • Technologies and Systems for Smart Power ans Mobility
      • More informations are comming soon
    • Technologies and Systems for Smart Health
      • More informations are comming soon
    • Technologies and Systems for Smart Production
      • Smart digital production
        • Digital manufacturing in mass production
        • Digital Roll-to-Product Manufacturing of Flexible Printed Smart Systems
      • More informations are comming soon
      • More informations are comming soon_B
    • More informations are comming soon.
  • Departments
    [X] Departments
    • Multi Device Integration
      • Main Focus of Research
        • Microfluidic Systemintegration
        • Sensor Integration
        • Optical Systems
        • New Materials
        • Parametertest
        • RF MEMS
        • Electronics Design
        • High Perfomance MEMS
      • Services
        • MEMS Design
        • Spectroscopy
        • RF MEMS Characterization
        • MEMS Analysis Service
        • Laser Micromachining
    • Micro Materials Center
      • More informations are comming soon.
    • Printed Functionalities
    • Back-End of Line
      • Research Fields
        • Processes and Materials
        • Interconnects for Micro and Nanoelectronics
        • 3D Integration
        • Simulation of Devices, Processes and Equipment
        • Materials and Metallization for NEMS
      • Services
    • Department System Packaging
      • Department System Packaging - Research Fields
        • Wafer-to-Wafer Bonding
        • 3D/MEMS Packaging
        • Biocompatible Packaging
        • Printing Technologies
        • MEMS applications
        • Characterization of bonding
        • Electrochemical deposition of special materials
        • Nanoimprint Lithography
        • Parylene based packaging
      • Services
    • Advanced System Engineering
      • Research Fields
        • Design of Electrical and Multi-Physical Systems
        • Wireless Sensor Systems
        • Wireless Energy Supply
        • Electromagnetic Near-Field Measurement Techniques
      • Services
  • Research and Development Services
    [X] Research and Development Services
    • Technologies
    • Processes
    • Analytics/Characterization
    • Design, Simulation and Modeling
    • Test
    • Demonstrators and Prototypes
    • Infrastructure
    • Smart System Campus
    • Portfolio Overview
  • Downloads
    [X] Downloads
    • Brochures
  • Career
    [X] Career
    • Employees
    • Trainees
  • News and Events
    [X] News and Events
    • Press Releases
      • 2017-06-28_Leti_and_Fraunhofer
      • 2017-07-05_EU Project EuroPAT-MASIP
      • 2017-08-30_COMPAMED2017_ProjectMIDARDI
      • 2017-09-19_MonitoringSystemElectroplatingSolutions_MSNS2017
      • 2018-03-14_For high-efficient computers using nanoscale biomolecules
      • 2018-04-10_ILA-BerlinAirShow2018
      • 2018-04-12_SSI2018_FinalReport
      • 2018-06-20_MircoProfTL_FRT+FraunhoferENAS_Sensor+Test2018
      • 2018-12-17_FraunhoferENAS_Research_Award_2018
      • 2018_12_17_Tohoku_University
      • 2018_12_17_Minapim_Brasilien
      • 2019-03-28_Globalfoundries, Fraunhofer-Gesellschaft und Next Big Thing gründen Start-up in Dresden
      • 2019_04_23_First Time - Thomas Gessner Award at SSI2019 granted
      • 2019-06-19_Al-Electroplating_SENSOR+TEST2019
      • 2019-06-20_Near-field-measurment_Sensor+Test2019
      • 2019-06-21_AlN-Technology_SENSOR+TEST2019
      • 2019-06-17_GoBeyond4.0
    • Trade Fairs
      • 3D & Systems Summit 2019
      • Intec 2019
      • LOPEC 2019
      • Smart Systems Integration 2019
      • BioCHIP 2019
      • Paris Air Show 2019
      • SENSOR+TEST 2019
      • SEMICON West 2019
      • IMTC 2019
      • MST-Kongress 2019
      • Agritechnica 2019
      • SEMCION Europa 2019
      • COMPAMED 2019
    • Conferences and Workshops
      • Conferences and Symposia
        • Archive Conferences and Symposia
      • Chemnitzer Seminare
        • 32. Chemnitzer Seminar
      • Workshops
        • Archiv Workshops
        • Workshop - Air Pulses without Pressurized Air
    • Events
      • Archives Events
      • Honorary Colloquium in Remembrance of Prof. Dr. Thomas Geßner
      • 10 Years Fraunhofer ENAS
      • 10 Years Fraunhofer ENAS - Registration
      • 10 Years Fraunhofer ENAS without registration
      • News and Events
    • Archives
      • MEMS Sensing & Network System 2016
      • SEMICON Europa 2016
      • COMPAMED 2016
      • European 3D Summit 2017
      • Smart Systems Integration 2017
      • SEMICON China 2017
      • LOPEC 2017
      • HANNOVER Messe 2017
      • SENSOR+TEST 2017
      • SEMIEXPO Russia 2017
      • International Paris Air Show 2017
      • Silicon Saxony Day 2017
      • MEMS Sensing & Network System 2017
      • MEMS Engineer Forum 2017
      • SEMICON Europa 2017
      • techtextil 2017
      • productronica 2017
      • COMPAMED 2017
      • Agritechnica 2017
      • European 3D Summit 2018
      • embedded world 2018
      • LOPEC 2018
      • SEMICON China 2018
      • Smart Systems Integration 2018
      • HANNOVER MESSE 2018
      • ILA - Berlin Air Show 2018
      • SENSOR+TEST 2018
      • SEMICON West 2018
      • MEMS Sensing & Network System 2018
      • COMPAMED 2018
      • electronica 2018
      • SEMICON Europa 2018
  • Contact / Directions
    [X] Contact / Directions
    • Ombudsman
    • Contact
      • Director
      • Marketing
      • Business Units
      • Directions
        • Fraunhofer Institute for Electronic Nano Systems ENAS
        • Contact Paderborn
        • International Offices
        • Fraunhofer Project Center
  • Obituary Professor Gessner
  • Unsubscribe
  • Registration
  • Gessner_Award
  • More

    Where am I?

    • Homepage
    • News and Events
    • Archives
    • European 3D Summit 2018

    European 3D Summit 2018

    Dresden, Germany  /  01/22/2018  -  01/24/2018

    European 3D Summit

    Heterogeneous Integration driving 3D

    European 3D Summit

    www.semi.org/eu/european-3d-summit-2018

    Fraunhofer Joint Booth

    Navigation and Social Media

    Share

    Quick Links

    • Commercial Customers
    • Press Releases
    • Job offers

    Related Links

    • Standard Purchasing Terms
    • General Terms and Conditions
    • Unsubscribe
    • Registration
    • Contact / Directions
    • Imprint
    • Data Protection
    © 2019

    Fraunhofer Institute for Electronic Nano Systems

    Online in Internet; URL: https://www.enas.fraunhofer.de/en/news_events/archives/european-3d-summit-2018.html

    Date: 5.12.2019 21:03