Fraunhofer Institute for Electronic Nano Systems
Fraunhofer Institute for Electronic Nano Systems
  • Career
  • News and Events
  • Contact / Directions
  • Sitemap
  • Deutsch
  • Career
    [X] Career
    • Employees
    • Trainees
  • News and Events
    [X] News and Events
    • Press Releases
      • 2017-06-28_Leti_and_Fraunhofer
      • 2017-07-05_EU Project EuroPAT-MASIP
      • 2017-08-30_COMPAMED2017_ProjectMIDARDI
      • 2017-09-19_MonitoringSystemElectroplatingSolutions_MSNS2017
      • 2018-03-14_For high-efficient computers using nanoscale biomolecules
      • 2018-04-10_ILA-BerlinAirShow2018
      • 2018-04-12_SSI2018_FinalReport
      • 2018-06-20_MircoProfTL_FRT+FraunhoferENAS_Sensor+Test2018
      • 2018-12-17_FraunhoferENAS_Research_Award_2018
      • 2018_12_17_Tohoku_University
      • 2018_12_17_Minapim_Brasilien
      • 2019-03-28_Globalfoundries, Fraunhofer-Gesellschaft und Next Big Thing gründen Start-up in Dresden
      • 2019_04_23_First Time - Thomas Gessner Award at SSI2019 granted
      • 2019-06-19_Al-Electroplating_SENSOR+TEST2019
      • 2019-06-20_Near-field-measurment_Sensor+Test2019
      • 2019-06-21_AlN-Technology_SENSOR+TEST2019
      • 2019-09-17_GoBeyond4.0
      • 2019-11-07_Memristor Whitepaper
      • 2020-11-05_Project_M3Infekt_FraunhoferENAS
      • 2020-11-12_Pressrelease_Fraunhofer-ENAS-virtualCOMPAMED2020
      • 2020-12-17_PressRelease_ResearchAward2020_FraunhoferENAS
      • 2021-03-22 Fraunhofer ENAS at LOPEC 2021
      • 2021_04_30_Smart Systems Integration
      • 2021-05-03 SENSOR+TEST 2021
      • 2021-05-18 Press Release Fraunhofer Cooperation Ultrasonic Transducer
      • 2021-06-10 Best Paper Award SSI2021
      • 2021-06-04 Press release TKOS FMD
      • 2021-07-01 Press release Miniature spectrometer for the smartphone
      • 2021-11-15_Ultra-thin_flexible_Parylene-based_PCB
      • 2022-01-28_Inductive-Bonding
      • 2022-03-01_InkjetPrinting_LOPEC2022
      • 2022-04-07_Continuation of the Micro/Nano Performance Center
      • 2022-06-28_Fraunhofer ENAS awards development of piezoelectric aluminum nitride MEMS platform with Fraunhofer ENAS Research Award 2021
      • 2022-07-21_Announcement Smart Systems Integration 2023 and Award Winners of the Smart Systems Integration Conference SSI2022 in Grenoble
      • 2022-07-28_Fraunhofer ENAS extends cooperation with memsstar
      • 2022-10-13_Recyclable food packaging: quality control for nanocoatings
      • 2022-11-10_Harald-Kuhn_Chairman-Advisory-Board-IVAM
      • 2022-12-08_Research Fab for quantum and neuromorphic computing: Launch of the Germany-wide cooperation FMD-QNC
      • 2023-07-27_FMD and Intel join forces to accelerate research
    • Trade Fairs
      • hy-fcell 2023
    • Conferences and Workshops
      • Conferences and Symposia
        • Archive Conferences and Symposia
      • Chemnitzer Seminare
        • 32. Chemnitzer Seminar
        • 36th Chemnitz Seminar
        • Registration Chemnitz Seminar
        • Double Opt-in Confirmation
        • Confirmation of Registration for Chemnitz Seminars
        • 37th Chemnitz Seminar
      • Workshops
        • Archiv Workshops
        • Workshop - Air Pulses without Pressurized Air
        • APPLAUSE Heterogeneous Integration Summer School
        • CMP and WET Users' Group Meeting 2022
        • 2023-07-05_Bruker Seminar/Workshop 2023
    • Events
      • Exhibitions "Science meets Arts"
      • Archives Events
      • Honorary Colloquium in Remembrance of Prof. Dr. Thomas Geßner
      • 10 Years Fraunhofer ENAS
      • 10 Years Fraunhofer ENAS - Registration
      • 10 Years Fraunhofer ENAS without registration
      • News and Events
    • Archives
      • MEMS Sensing & Network System 2016
      • SEMICON Europa 2016
      • COMPAMED 2016
      • European 3D Summit 2017
      • Smart Systems Integration 2017
      • SEMICON China 2017
      • LOPEC 2017
      • HANNOVER Messe 2017
      • SENSOR+TEST 2017
      • SEMIEXPO Russia 2017
      • International Paris Air Show 2017
      • Silicon Saxony Day 2017
      • MEMS Sensing & Network System 2017
      • MEMS Engineer Forum 2017
      • SEMICON Europa 2017
      • techtextil 2017
      • productronica 2017
      • COMPAMED 2017
      • Agritechnica 2017
      • European 3D Summit 2018
      • embedded world 2018
      • LOPEC 2018
      • SEMICON China 2018
      • Smart Systems Integration 2018
      • HANNOVER MESSE 2018
      • ILA - Berlin Air Show 2018
      • SENSOR+TEST 2018
      • SEMICON West 2018
      • MEMS Sensing & Network System 2018
      • COMPAMED 2018
      • electronica 2018
      • SEMICON Europa 2018
      • 3D & Systems Summit 2019
      • Intec 2019
      • LOPEC 2019
      • Smart Systems Integration 2019
      • BioCHIP 2019
      • Paris Air Show 2019
      • SENSOR+TEST 2019
      • SEMICON West 2019
      • IMTC 2019
      • MST-Kongress 2019
      • Agritechnica 2019
      • SEMCION Europa 2019
      • COMPAMED 2019
      • MEMS Sensing & Network System 2020
      • mtex+ 2020
      • SENSOR+TEST 2020
      • MEMS Sensing & Network Systems 2021
      • MEF 2021
      • Fraunhofer Solution Days 2020
      • virtual.COMPAMED 2020
      • COMPAMED 2021
      • SEMICON Europa 2021
      • SENSOR+TEST 2021
      • LOPEC 2021
      • MEMS Sensing & Network System 2022
      • InPrint Munich 2022
      • LOPEC 2022
      • Smart Systems Integration 2022
      • SENSOR+TEST 2022
      • HANNOVER MESSE 2022
      • FC³ Fuel Cell Conference Chemnitz
      • techtextil 2022
      • ILA Berlin Air Show 2022
      • Farnborough International Airshow 2022
      • COMPAMED 2022
      • SEMICON Europa 2022
      • MEMS Sensing & Network System 2023
      • LOPEC 2023
      • intec 2023
      • SSI 2023
      • HANNOVER MESSE 2023
      • SENSOR+TEST 2023
      • LASER World of PHOTONICS 2023
  • Contact / Directions
    [X] Contact / Directions
    • Management of the Institute
      • Prof. Dr. Harald Kuhn
      • Romy Weller
      • Prof. Dr. Harald Kuhn
      • Dr. Stefanie Zimmermann
      • Prof. Dr. Stefan E. Schulz
    • Business Units and Functional Teams
      • Process, Device and Packaging Technologies
        • Prof. Dr. Stefan E. Schulz
        • Dr. Jörg Schuster
        • Dr. Danny Reuter
        • Prof. Dr. Karla Hiller
        • Dr. Maik Wiemer
        • Dr. Sascha_Hermann
        • Dr. Patrick Matthes
        • Birgit Weber
        • Mareen Bunar
        • Yvonne Ostmeier-Ullmann
      • Intelligent Sensor and Actuator Systems
        • Dr. Roman Forke
        • Andreas Morschhauser
        • Dr. Jörg Martin
        • Dr. Christan Hedayat
        • Dr. Alexander Weiß
        • Michaela Baum
      • Systems and Applications
        • Rainer Kaltschmidt
        • Dr. Mario Braun
        • Alissa Hölzl
        • Prof. Dr. Ralf Zichner
        • Dr. Mario Baum
        • Diana Maier
      • Cross-Functional Topics
        • Functional Team Artificial Intelligence
        • Functional Team »Reliability«
        • Dr. Jan Langer
        • Prof. Dr. Sven Rzepka
    • Corporate Strategy
      • Dr. Steffen Kurth
      • Dr. Christian Irmscher
      • Alexander Schade
      • Heiko Maier
    • Infrastructure and Fab Management
      • Dr. Ramona Ecke
      • Thomas Ronneburger
      • Michael Schubert
    • Ombudsman
    • Direction Paderborn
    • Direction Fraunhofer ENAS Chemnitz
  • Institute
    [X] Institute
    • Profile
    • Board of trustees
    • Organization Chart
    • Quality Management
      • Quality Policy
      • Mission and Vision
      • Guiding Principles of Fraunhofer ENAS
    • Data and Facts
      • Financial situation and investment
      • Personnel development
      • History
    • Cooperations
      • Cooperation within Fraunhofer-Gesellschaft
      • Cooperation with universities
      • Networks
  • Business Units
    [X] Business Units
    • Process, Device and Packaging Technologies
      • Simulation
        • Simulation of devices
        • Simulation of processes
      • Technologies and Processes
        • CVD-, ALD- und High-Temperature Processes
      • 3D/MEMS Packaging
        • Wafer-to-Wafer-Bonding
        • Characterization of Bonding
        • 3D Integration
        • Parylene Based Packaging
        • Interconnect
      • MEMS Technology Platforms
        • Piezoelectric Microsystems
        • Bonding and Deep RIE
        • Airgap insulated microstructures
        • Bulk Micromachining
        • Membrane based devices
      • Nanotechnological Components and Systems
        • Platform for 1D/2D Nanostructures
        • 1D/2D Nanodevices
        • Heterogeneous Integration of Nanodevices
        • Spintronic Devices
        • Optical Nano Structures
        • Memristive Devices
      • Nanotechnological Components and Systems
    • Intelligent Sensor and Actuator Systems
      • Inertial Components and Systems
        • Acceleration Sensors
        • Vibration Sensors
        • High Precision MEMS Angular Rate Sensor
      • Microfluidic for Lab-on-Chip Systems
        • Biosensor Integration
        • Assay Integration
        • Fabrication of microfluidic systems
      • Optical Components and Systems
        • Spectral Components
        • Sensor and Imaging Systems
        • Service: Material and Surface Characterization
      • Hybrid and Wireless Sensors and Systems
        • Wireless multi-sensor systems
        • Wireless Power Transfer
        • Hybrid Sensors
      • RF Components and Systems
        • RF MEMS Switch
        • RF MEMS characterization
      • Acoustic Components
        • CMUT - Capacitive Micromechanical Ultrasonic Transducer
        • PMUT – A new generation of ultrasonic transducers
    • Systems and Applications
      • Technologies
        • Flexible and integrable electronics
        • CCM, MEA and biomedical sensors
      • Methodologies
      • Customer Domains
        • Medicine and medical technology Applications
        • Semiconductor Industry, Microsystems Technology, System Providers
        • Mechanical engineering, robotics
        • Energy
      • Regulatory Competences
    • Cross-Functional Topics
      • Reliability
        • Lifetime Test and Modeling
        • Analytics and Characterization
        • Reliability of Components and Systems
      • Artificial Intelligence
        • Acceleration through AI
        • Sensor-based data fusion
        • Demonstrator: Digital Twin Chemical Mechanical Polishing (CMP)
        • Integratable Spectral Sensing in Multi-Reactor Technology - Result Interpretation Using Neural Networks
        • AI-Supported Development of Electronic Systems for Future Vehicle Generations in the progressivKI Project
        • Implementation of a Novel Magnetic Field-Based Location Method Using AI
      • Preliminary Research
      • FAB Management
        • Inline Metrology and Process Data
      • Corporate Strategy
  • Research and Development Services
    [X] Research and Development Services
    • Technologies
    • Processes
    • Processes
    • Processes
    • Analytics/Characterization
    • Design, Simulation and Modeling
    • Test
    • Demonstrators and Prototypes
    • Infrastructure
    • Smart Systems Campus
    • Portfolio Overview
  • Downloads
    [X] Downloads
    • Brochures
  • More

    Where am I?

    • Homepage
    • News and Events
    • Archives
    • European 3D Summit 2018

    European 3D Summit 2018

    Dresden, Germany  /  January 22, 2018  -  January 24, 2018

    European 3D Summit

    Heterogeneous Integration driving 3D

    European 3D Summit

    www.semi.org/eu/european-3d-summit-2018

    Fraunhofer Joint Booth

    Navigation and Social Media

    Share

    Quick Links

    • Commercial Customers
    • Press Releases
    • Career
    • Fraunhofer Tender Platform

    Related Links

    Follow us

    • General Terms and Conditions
    • Standard Purchasing Terms
    • Unsubscribe
    • Registration
    • Contact / Directions
    • Imprint
    • Data Protection
    © 2023

    Source: Fraunhofer-Gesellschaft
    Fraunhofer Institute for Electronic Nano Systems - European 3D Summit 2018

    Online in Internet; URL: https://www.enas.fraunhofer.de/en/news_events/archives/european-3d-summit-2018.html

    Date: 26.9.2023 18:15