Japan  /  April 14, 2021  -  May 31, 2021, Live symposium - Apr 21-22, 2021 | Symposium on demand and virtual exhibition online until May 31, 2021

MEMS Engineer Forum 2021#

Live symposium and virtual exhibition

MEF 2021

The MEMS Engineer Forum (MEF) will take place in 2021 as a digital symposium and virtual exhibition. It has been organized annually in Japan since 2009 and provides a platform for researchers, developers and engineers to exchange information on the latest developments in MEMS technologies. This year, Fraunhofer ENAS will present selected bonding and packaging technologies for MEMS, MEMS components and MEMS-based systems at the virtual exhibition.



A short presentation of the exhibition topics will be given by Dr. Mario Baum of Fraunhofer ENAS on April 21, 4:10-4:20 pm (JST).

Learn more about our featured bonding and packaging technologies for MEMS, MEMS components and MEMS-based systems.