Portfolio of Services and Testing Infrastructure of the ETRC

Services at a Glance

With its state-of-the-art testing infrastructure, in-depth expertise, and strong network of partners from science and industry, the European Test and Reliability (ETRC) provides comprehensive solutions for assessing the quality, functionality, and durability of pioneering semiconductor technologies.

The ETRC’s portfolio of services includes:

  • Research and development of new testing and assessment methods
  • Optimization of testing and assessment methods for specific applications
  • Verification services for small batches
  • Application-focused advice
  • Training and continuing education in testing procedures and reliability assessments for specialists

Both high-tech corporations and small and midsize enterprises in the semiconductor industry benefit from:

  • Leading testing and reliability assessment methods from a single source
  • Enhanced product quality
  • Reduced development costs
  • Guaranteed maximum product reliability throughout the entire product life cycle
  • Optimized time-to-market strategies
  • Rapid and successful scaling of robust semiconductor innovations
Industrialization of Cutting-Edge Testing Methods in Key Future Fields
  • High-power technologies
  • Heterogeneous integration/chiplets
  • Optical measurement technology and photonics
  • MEMS sensor technology
  • Inline measurement technology/metrology
  • AI-based data models and digital twins
  • Design for testing and reliability
  • Micro and nano systems technology/electronics
Industry Offerings
  • Development of testing methods to ensure the reliability of semiconductor systems in safety-critical applications
  • Consulting services for companies developing proprietary testing and verification solutions
  • Implementation of method-driven testing from initial design to full industrial deployment
  • Tailored solutions for applications in power electronics, sensor technology, digital components (CMOS), and optical systems
  • Optimization of testing procedures and methods
  • Access to state-of-the-art testing methods, including for silicon carbide (SiC) and gallium nitride (GaN)
  • Development of fast and precise reliability models and lifetime predictions
Services for Research and Development
  • Tests at the wafer, chip, and component level
  • Characterization
  • Reliability assessments
  • Data analysis
Test Services at the Wafer, Chip, and Component Level
  • Electrical tests (functional, burn-in, and performance tests) with automated wafer probers
  • Optical tests using an optical probe station for photonic integrated circuits
  • Magnetic tests for MRAM and magnetic sensors
  • MEMS tests (C, V, I, f0, Q, specific parameters) and motion analyses for MEMS (including under vacuum)
  • High-frequency testing
  • Acoustic testing for micromechanical ultrasonic transducers (MUTs) and acoustic components
  • Near-field measurements for EMC diagnostics and fault detection
  • High-power testing