Technologies and Processes

Business Unit » Process, Device and Packaging Technologies«

Fraunhofer ENAS offers research and development services on the whole spectrum of semiconductor and nanotechnological processes for the fabrication and integration of electronic, optical and mechanical micro and nano devices. To this end, individual processes are being further developed and, above all, process and technology integration concepts are being established and implemented. The main focus is on advanced patterning processes based on micro- and nanolithographic methods, a variety of different dry etching processes from reactive ion etching (RIE) to gas phase etching as well as wet etching and cleaning processes. Electron beam lithography and nanoimprint lithography (NIL) are of particular interest, as they allow flexible and cost-effective production of structures with dimensions below 50 nm for industrial applications. Furthermore, a wide range of deposition processes is available to ensure the necessary material diversity. From atomic layer deposition, conventional PE, LP and MOCVD processes, high temperature processes, electrochemical deposition (ECD), electron beam evaporation to specific sputtering processes, many functional materials can be used on 150 and 200 mm substrates. The process portfolio is rounded off by processes for surface treatment and substrate processing. Several systems for chemical mechanical polishing (CMP), grinding and spin etching are available for this purpose. In addition, MEMS packaging processes and a large number of inline metrology and measurement tools are available for the realization of systems.

Lithography for MEMS, NEMS and Nanodevices


CVD-, ALD- und High Temperature Processing


Inline Metrology and Process Data


Electrochemical Deposition

Physical Vapor Deposition

Plasma Etching and Process Diagnostics

Wet Etching and Wafer Cleaning

Chemical-Mechanical-Polishing and Grinding