Fraunhofer ENAS presents R&D results of process, component and system development on site in Tokyo at MEMS Sensing & Network System 2023. We show a MEMS-based gyrocompass, a fluid property sensor, components for medical technology, printing technologies as well as nano and micro technologies.

Nano and micro technologies

  • Deposition technologies: electrochemical deposition from water-based electrolytes and ionic liquids on wafer level
  • Technology platform for carbon nano devices
  • Bonding technologies:
    • reactive bonding by using multi nano layer systems
    • induction heating for chip level bonding
    • low-temperature adhesive bonding by using biocompatible Parylene C

Printing technologies

  • Screen Printing for MEMS packaging and wafer bonding
  • 3D electronic systems by using additive and digital deposition technologies

Components for medical applications

  • Ultra-thin and highly flexible Parylene-based PCB with multiple metallization layers
  • Electrically active wound patch with printed electrodes on flexible substrates
  • Piezoelectric micro sensors for OCT applications

Piezoelectric and capacitive micromachined ultrasonic transducer

Gyrocompass based on a high-precision MEMS gyroscope

MEMS-based fluid property sensor