Munich, Germany / November 13, 2018 - November 16, 2018
electronica
World's Leading Trade Fair for Electronic Components, Systems and Applications
hall C5, booth 426
Fraunhofer Pavilion
World's Leading Trade Fair for Electronic Components, Systems and Applications
hall C5, booth 426
Fraunhofer Pavilion
Fraunhofer ENAS presents its latest R&D results at the electronica 2018 from November 13 - 16 in Munich, Germany.
Wireless Charging of Micro Process Measurement Devices in Bioreactors
Fraunhofer ENAS shows a location-independent acquisition of process measurement signals in novel bioreactor systems. This joint project is funded by BMBF and within the project Projekt Sens-o-Sphere work the cooperation partners e-nema GmbH, Fraunhofer ENAS, IMST GmbH, Ökoplast GmbH, SAAS GmbH and TU Dresden INT to develop a location-independent, fully autarkical, minimally disrupting micro measuring device. Therefore, a typical measurement device for e.g. temperature, pH value or dissolved oxygen is converted into sphere with 8 mm diameter sending wireless from the bioreactor. The system provides a comprehensive knowledge of the biotechnological process for an efficient and resource saving production of target products such as pharmaceutical agents as well as enzymes based on renewable resources.
Fraunhofer ENAS develops within the project a system for wireless charging of the spheres. The batteries of the spheres are inductive recharged between its use in the bioreactor. The challenge was the tiny size of the spheres. A three layer folded PCB, a receiver coil for the charging process as well as electronics and a battery had to be integrated in a sphere of 8 mm diameter. Another challenge was the random position of the spheres during the charging process. It was solved by using a multi coil charging station.
MicroProf® TL
Together with FRT GmbH and CWM GmbH, Fraunhofer ENAS presents the MicroProf® TL, an optical measurement tool with thermo unit incl. fully integrated heating and cooling plate. The tool is used for automated 3D surface metrology under thermal load for PCB design and simulation, 3D-IC, MEMS, bonded wafers and fault analysis. (more information: https://frtmetrology.com/en/products/microprof/microprof-tl/)