The particular strength of the Fraunhofer Institute for Electronic Nano Systems ENAS lies in the development of smart integrated systems for different applications. Fraunhofer ENAS develops single components, technologies for their manufacturing as well as system concepts and system integration technologies and transfers them into production. The institute offers research and development services from the idea, via design and technology development or realization based on established technologies to tested prototypes.

The product and service portfolio of Fraunhofer ENAS covers high-precision sensors for industrial applications, sensor and actuator systems with control units, and evaluation electronics, printed functionalities as well as material and reliability research for microelectronics and microsystem technology. The development, the design and the test of MEMS/NEMS, methods and technologies for their encapsulation and integration with electronics as well as metallization and interconnect systems for micro- and nanoelectronics and 3D integration are especially in the focus of the work. Branches addressed are semiconductor industry, communication technology, medical engineering, biotechnology, industry automation, mechanical engineering, automotive industry, environmental engineering, power engineering, logistics as well as aeronautics.

The core competences are an indicator for the specific technological know-how of the institute. The excellence of Fraunhofer ENAS is based on a broad variety of technologies and methods for smart systems integration. These are 'Design and Test of Components and Systems','Silicon-Based Technologies for Micro and Nano Systems', 'Polymer-Based Technologies for Micro and Nano Systems, 'Printing Technologies for Functional Layers and Components', 'Nano Technologies for Components and Systems', 'Interconnect Technologies', 'System Packaging and 3D Integration Technologies', 'System Development and Integration' as well as 'Reliability of Components and Systems'.

From an organizational point of view, Fraunhofer ENAS is subdivided into the departments Multi Device Integration, Micro Materials Center, Printed Functionalities, Back-End of Line, System Packaging, Advanced System Engineering and Administration. The headquarters of Fraunhofer ENAS is located in Chemnitz. The department Advanced System Engineering is working in Paderborn. The department Micro Materials Center has a project group working in Berlin-Adlershof.