Cork/Ireland  /  March 08, 2017  -  March 09, 2017

International Conference and Exhibition

Smart Systems Integration 2017

booth no 1-A
joint booth with Fraunhofer IZM, IPMS and EMFT

Fraunhofer ENAS will show R&D samples presented within the oral presentations and posters on its exhibition booth at the accompanying exhibition of the SSI conference. We present several high-precision inertial sensors for applications in medical engineering and packaging solutions based on printing, coating and integration technologies. We also introduce methods for reliability analyses of smart systems.


Oral presentations:

Wed, March 8, 2017, 11:05 am
3D packaging technologies for smart medical implants
Tim Schröder, Fraunhofer ENAS
Session II - System integration and packaging I
Room: Gandore Suite

Wed, March 8, 2017, 2:10 pm
Sens-o-Spheres | A concept for location independent acquisition of process measurement signals
Tobias Lüke, Fraunhofer ENAS
Session III - Design of smart integrated systems II
Room: Baltimore Suite

Wed, March 8, 2017, 5:15 pm
Manufacturing of all-inkjet-printed electronic devices on flexible polymer substrates
Enrico Sowade, TU Chemnitz
Session V - Low cost approaches
Room: Baltimore Suite

Thu, March 9, 2017, 10:15 am
Novel negative tone spray-coatable photoresist for photolithography processing over high topographical steps
Markus Arnold, TU Chemnitz
Session IX - New materials for nano structures and devices
Room: Gandore Suite



The poster session is presented in the exhibition rooms on March 8 from 3:25 - 4:25 pm and on March 9 from 1:30 - 2:30 pm.

Novel concept of integrated microactuation of membranes in liquid environments
Tom Enderlein, Fraunhofer ENAS

Filling of high aspect ratio (AR) nanometer-scale trenches by electrochemical deposition of nickel
Christian Hofmann, Fraunhofer ENAS

Integration of self-healing agent into MEMS bonding frames
Florian Kurth, Fraunhofer ENAS

Influence of processing atmosphere for QD-LEDs
Jörn Langenickel, TU Chemnitz

Detection of mechanical loads in lightweight structures using quantum dots photoluminescence
Martin Möbius, TU Chemnitz

Thermo-mechanical and mechanical robustness of the INCOBAT smart battery management system
Alexander Otto, Fraunhofer ENAS

Robust vibration sensor for condition monitoring in railway applications
Michael Pleul, TU Chemnitz

Development of sensor integration concept for mass production processes
Florian Rost, Fraunhofer ENAS

Effective viscoelastic plastic material modeling for faster and reliable calculations
Florian Schindler-Saefkow, Fraunhofer ENAS

Inductive temperature measurement for fast and optimized adhesive curing
Dominik Schröder, Fraunhofer ENAS

Increase of functional density of hybrid structures by integration of micro and nano systems
Martin Schüller, Fraunhofer ENAS

Investigations on Parylene C for its integrability into MEMS
Franz Selbmann, Fraunhofer ENAS