Test

Wafer and chip test

 

• Electrical parameters (resistance, capacitance, piezoelectric coefficient)
• Mechanical parameters (Eigenfrequencies, Q-factor)
• RF S parameters
• Nonlinearity
• Dielectric material parameters
• Transmission and reflection
• Surface parameters
• Vibrometry (out-of-plane, infrared and 3D in-plane)
• Motion analysis
• Vibrational analysis
• Combination of numerical simulation and characterization methods for parameter identification
• Electromagnetic compatibility
• Specific probe card development

 

Test programs for component and system tests

 

• Controllable optical filters
• Acceleration sensors
• Inclinometers
• Gyroscopes
• RF MEMS switches
• Wireless sensor nodes

 

Reliability

• Mechanical strain: pulling, pressure, shearing, bending, scratch, vibration, shock
• Structural reliability of composites (fatigue master curve)
• Compact tension (CT) fracture mechanical tests: single and multi-mode, critical and sub-critical, bulk and interfaces
• Nano-fatigue, membrane tests
• Thermo-electro-mechanical endurance: HT, (H)TC, APC
  • High-temperature shock test: -80 °C  - 500 °C
  • Thermal shock test: -80 °C - 220 °C
  • Power cycle tests: up to 1800 A, 80 V (air, oil)
• Accelerated lifetime tests with combined loads:
  • Temperature profile: -60 °C - 180 °C
  • Humidity range: 10 % - 40 %
  • Mechanical vibration: 1 Hz - 3 kHz
  • Electrical loads: bias voltage, electrical power
• Environmental testing: moisture, mist, corrosive atmosphere
  • Climate testing: -60 °C - 180 °C
  • Humidity: 10 % - 95 % mist      
• Field-like long-term climatic and stress tests: 5 to 15 years in the underground reliability lab (former ore mine)
• RF and microwave performance: functionality, electromechanical compatibility
• Near field measurement for EMC tests and debugging