Test

Wafer and chip test

• Electrical parameters
• RF S parameters
• Nonlinearity
• Dielectric material parameters
• Transmission and reflection
• Surface parameters
• Vibrational analysis
• Combination of numerical simulation and characterization methods for parameter identification
• Electromagnetic compatibility
• Specific probe card development

 

Test programs for component and system tests

• Controllable optical filters
• Acceleration sensors
• Gyroscopes
• RF MEMS switches
• Wireless sensor nodes

 

Reliability

• Mechanical strain: pulling, pressure, shearing, bending, scratch, vibration, shock
• Structural reliability of composites (fatigue master curve)
• Compact tension (CT) fracture mechanical tests: single and multi-mode, critical and sub-critical, bulk and interfaces
• Nanofatigue, membrane tests
• Thermoelectromechanical endurance: HT, (H)TC, APC
  • Thermal cycle test: -80 °C  ... 500 °C,
  • Power cycle tests: up to 500 A, 80 V (air, oil)
• Accelerated lifetime tests with mixed loads:
  • Temperature cycle: -60 °C ... 180 °C
  • Humidity range: 10 % ... 90 %
  • Mechanical vibration: 0.1 Hz … 3 kHz
  • Electrical loads: bias voltage, electrical power
• Environmental testing: humidity, degradation, corrosion
  • Climate storage and shock testing: -60 °C ... 180 °C, humidity 10 %.... 90 %, salt dust      
• Field-like long-term climatic and stress tests: 2 …10 years in the underground reliability lab (old silver mine)
• RF and microwave performance: functionality, electromechanical compatibility
• Near field measurement for EMC tests and debugging