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Fraunhofer Institute for Electronic Nano Systems
Fraunhofer Institute for Electronic Nano Systems
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Cooperation within Fraunhofer-Gesellschaft
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Research Fab Microlectronics Germany
APECS
European Test and Reliability Center
Portfolio of Services and Testing Infrastructure
Electromagnetic Near-Field Measurement Techniques
Industry Solutions
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Business Units
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Business Units
Process, Device and Packaging Technologies
Simulation
Simulation of devices
Simulation of processes
Technologies and Processes
Lithography for MEMS, NEMS and Nanodevices
CVD-, ALD- und High-Temperature Processes
Plasma Etching and Process Diagnostics
3D/MEMS Packaging
Wafer-to-Wafer-Bonding
Characterization of Bonding
3D Integration
Parylene Based Packaging
Interconnect
Chip-to-Wafer and Chip-to-Chip bonding
MEMS Technology Platforms
Piezoelectric Microsystems
Bonding and Deep RIE
Airgap insulated microstructures
Bulk Micromachining
Membrane based devices
Nanotechnological Components and Systems
Platform for 1D/2D Nanostructures
1D/2D Nanodevices
Heterogeneous Integration of Nanodevices
Spintronic Devices
Optical Nano Structures
Memristive Devices
Nanotechnological Components and Systems
Smart Systems
Inertial Components and Systems
Acceleration Sensors
Vibration Sensors
High Precision MEMS Angular Rate Sensor
Optical Components and Systems
Spectral Components
Sensor and Imaging Systems
Service: Material and Surface Characterization
Hybrid and Wireless Sensors and Systems
Wireless multi-sensor systems
Wireless Power Transfer
Hybrid Sensors and Actuators
RF Components and Systems
RF MEMS Switch
RF MEMS characterization
Acoustic Components
CMUT - Capacitive Micromechanical Ultrasonic Transducer
PMUT – A new generation of ultrasonic transducers
Printed Functionalities
Printed, flexible and hybrid electronics
Roll-to-roll printing machines, sheet format and printing on 3D objects
Printed Catalyst Coated Membrane (CCM) / MEA for their application in fuel cells and electrolyzers
Medical Systems and Smart Health
Microfluidic for Lab-on-Chip Systems
Theranostic Implants
Endostim
Devices for NeuroControl and NeuroRehabilitation (DeNeCor)
Project Apfel
M³Infekt
beforeFever
Test and Reliability Solutions
Reliability
Lifetime Test and Modeling
Characterization and Analytics
Reliability of Components and Systems
Data-based Methods
Acceleration through AI
Sensor-based data fusion
Demonstrator: Digital Twin Chemical Mechanical Polishing (CMP)
Integratable Spectral Sensing in Multi-Reactor Technology - Result Interpretation Using Neural Networks
AI-Supported Development of Electronic Systems for Future Vehicle Generations in the progressivKI Project
Implementation of a Novel Magnetic Field-Based Location Method Using AI
AI-based Image Analysis
Cross-Functional Topics
FAB Management
Inline Metrology and Data
Corporate Strategy
International Sales
Research focus
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Research focus
Design, Simulation and Digital Models
Wafer Processes
Wafer-Level Packaging and Heterogeneous Integration
Smart System Integration
Testing, Characterization, Reliability
Projects
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Projects
Print4POC+
DORMO
NewLPCVD
SuperComp
DeLiQuaT
GraSonics
News and Events
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News and Events
Press and News
Archive News
2024-04-23_Best Paper Award SSI
Process modeling
Interview I Hiring of trainees
Interview Trust-E
Interview Macwelt
IVAM Podcast
Visit by Vietnamese delegation
reliability tests
HaloFreeEtch
UpFUSE
Cooperation Fraunhofer ENAS & Klinikum Chemnitz
IHK Award
Nanotom
Sustainability: Certification
KoVoPack
Parylene
Jochen Mueller
PFAS
DORMO
Ralf Arnold
CRYME
Events
Chemnitz Seminars
Archive: Chemnitz Seminars
Registration Chemnitz Seminar
45th Chemnitz Seminar
Chemnitz Seminar Test and Reliability
Chemnitz Seminar One Health
Exhibition Series "Science meets Art"
LABORATORY 2025
Ganz aus dem Häuschen
MarcoHabeck
Tilman Hornig
Daniel Krüger
Peter Piek
Fraunhofer Symposia
Archive: Fraunhofer Symposia
15th Fraunhofer Symposium Sendai
16th Fraunhofer Symposium
Archive_Events
Career
Contact / Directions
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Contact / Directions
Management of the Institute
Dr. Stefanie Zimmermann
Prof. Dr. Harald Kuhn
Prof. Dr. Harald Kuhn
Franziska Gassenbauer
Business Units
Process, Device and Packaging Technologies
Dr. Jochen Müller
Dr. Jörg Schuster
Dr. Danny Reuter
Prof. Dr. Karla Hiller
Dr. Maik Wiemer
Dr. Sascha_Hermann
Birgit Weber
Mareen Bunar
Yvonne Ostmeier-Ullmann
Smart Systems
Dr. Roman Forke
Andreas Morschhauser
Dr. Jörg Martin
Prof. Dr. Christan Hedayat
Dr. Alexander Weiß
Dr. Mario Baum
Prof. Dr. Ralf Zichner
Annika Göhring
Marlen Eschrich
Test and Reliability Solutions
Dr. Mario Braun
Dr. Diana Maier
Harald Kuhn
Dr. Jan Langer
"Reliability"
Stefanie Glöckner
European Test and Reliability Center
Corporate Strategy
Dr. Steffen Kurth
Dr. Christian Irmscher
Heiko Maier
International Sales
Rainer Kaltschmidt
Benjamin Schreiber
Bianca Milde
Wolfgang Bohrer
Infrastructure and Fab Management
Dr. Ramona Ecke
Thomas Ronneburger
Michael Schubert
Ombudsman
Direction Paderborn
Direction Fraunhofer ENAS Chemnitz
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Business Units
Process, Device and Packaging Technologies
3D/MEMS Packaging
Interconnect
Interconnect
Business Unit »Process, Device and Packaging Technologies«
Electrochemical Deposition (ECD)
more about Electrochemical Deposition (ECD)
Fraunhofer Institute for Electronic Nano Systems