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Outstanding Paper Award of InterPACK 2020
2023-07-27_FMD and Intel join forces to accelerate research
2024-04-23_Best Paper Award SSI
2024-05-30_One-Stop Store for Micromechanical Ultrasound
2024-08-05_Start CCoE
Process modeling
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IVAM Podcast
20240918_PressRelease_TRC
Visit by Vietnamese delegation
reliability tests
HaloFreeEtch
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20241124_PressRelease_Innovation Office Regensburg
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39th Chemnitz Seminar
40th Chemnitz Seminar
41st Chemnitz Seminar
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Smart Systems Integration Conference 2024
Exhibition Series "Science meets Art"
Natur – Mensch – Technik 2021 – Ines Escherich
LABORATORY 2025
Ganz aus dem Häuschen
MarcoHabeck
Tilman Hornig
Daniel Krüger
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14th Fraunhofer Symposium Sendai
15th Fraunhofer Symposium Sendai
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2023-07-05_Bruker Seminar/Workshop 2023
Vernissage: rēənˈvent / reinvent - Malerei Daniel Krüger
Colloquium "Digital Image and Volume Correlation"
Print heating pipes easily using the inkjet process
Press Releases
2017-06-28_Leti_and_Fraunhofer
2017-07-05_EU Project EuroPAT-MASIP
2017-08-30_COMPAMED2017_ProjectMIDARDI
2017-09-19_MonitoringSystemElectroplatingSolutions_MSNS2017
2018-03-14_For high-efficient computers using nanoscale biomolecules
2018-04-10_ILA-BerlinAirShow2018
2018-04-12_SSI2018_FinalReport
2018-06-20_MircoProfTL_FRT+FraunhoferENAS_Sensor+Test2018
2018-12-17_FraunhoferENAS_Research_Award_2018
2018_12_17_Tohoku_University
2018_12_17_Minapim_Brasilien
2019-03-28_Globalfoundries, Fraunhofer-Gesellschaft und Next Big Thing gründen Start-up in Dresden
2019_04_23_First Time - Thomas Gessner Award at SSI2019 granted
2019-06-19_Al-Electroplating_SENSOR+TEST2019
2019-06-20_Near-field-measurment_Sensor+Test2019
2019-06-21_AlN-Technology_SENSOR+TEST2019
2019-09-17_GoBeyond4.0
2019-11-07_Memristor Whitepaper
2020-11-05_Project_M3Infekt_FraunhoferENAS
2020-11-12_Pressrelease_Fraunhofer-ENAS-virtualCOMPAMED2020
2020-12-17_PressRelease_ResearchAward2020_FraunhoferENAS
2021-03-22 Fraunhofer ENAS at LOPEC 2021
2021_04_30_Smart Systems Integration
2021-05-03 SENSOR+TEST 2021
2021-05-18 Press Release Fraunhofer Cooperation Ultrasonic Transducer
2021-06-10 Best Paper Award SSI2021
2021-06-04 Press release TKOS FMD
2021-07-01 Press release Miniature spectrometer for the smartphone
2021-11-15_Ultra-thin_flexible_Parylene-based_PCB
2022-01-28_Inductive-Bonding
2022-03-01_InkjetPrinting_LOPEC2022
2022-04-07_Continuation of the Micro/Nano Performance Center
2022-06-28_Fraunhofer ENAS awards development of piezoelectric aluminum nitride MEMS platform with Fraunhofer ENAS Research Award 2021
2022-07-21_Announcement Smart Systems Integration 2023 and Award Winners of the Smart Systems Integration Conference SSI2022 in Grenoble
2022-07-28_Fraunhofer ENAS extends cooperation with memsstar
2022-10-13_Recyclable food packaging: quality control for nanocoatings
2022-11-10_Harald-Kuhn_Chairman-Advisory-Board-IVAM
2022-12-08_Research Fab for quantum and neuromorphic computing: Launch of the Germany-wide cooperation FMD-QNC
2023-07-27_FMD and Intel join forces to accelerate research
2024-05-30_One-Stop Store for Micromechanical Ultrasound
2024-08-05_Start CCoE
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FC³ Fuel Cell Conference Chemnitz
techtextil 2022
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MEMS Sensing & Network System 2023
LOPEC 2023
intec 2023
SSI 2023
HANNOVER MESSE 2023
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LASER World of PHOTONICS 2023
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Management of the Institute
Dr. Stefanie Zimmermann
Prof. Dr. Harald Kuhn
Prof. Dr. Harald Kuhn
Franziska Gassenbauer
Business Units
Process, Device and Packaging Technologies
Prof. Dr. Harald Kuhn
Dr. Jörg Schuster
Dr. Danny Reuter
Prof. Dr. Karla Hiller
Dr. Maik Wiemer
Dr. Sascha_Hermann
Dr. Patrick Matthes
Birgit Weber
Mareen Bunar
Yvonne Ostmeier-Ullmann
Smart Systems
Dr. Roman Forke
Andreas Morschhauser
Dr. Jörg Martin
Dr. Christan Hedayat
Dr. Alexander Weiß
Dr. Mario Baum
Prof. Dr. Ralf Zichner
Annika Göhring
Marlen Eschrich
Test and Reliability Solutions
Dr. Mario Braun
Alissa Hölzl
Dr. Diana Maier
Harald Kuhn
Dr. Jan Langer
»Reliability«
Stefanie Glöckner
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Dr. Steffen Kurth
Dr. Christian Irmscher
Alexander Schade
Heiko Maier
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Rainer Kaltschmidt
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Dr. Ramona Ecke
Thomas Ronneburger
Michael Schubert
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Lithography for MEMS, NEMS and Nanodevices
CVD-, ALD- und High-Temperature Processes
Plasma Etching and Process Diagnostics
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Wafer-to-Wafer-Bonding
Characterization of Bonding
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Parylene Based Packaging
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Piezoelectric Microsystems
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Airgap insulated microstructures
Bulk Micromachining
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Hybrid and Wireless Sensors and Systems
Wireless multi-sensor systems
Wireless Power Transfer
Hybrid Sensors and Actuators
RF Components and Systems
RF MEMS Switch
RF MEMS characterization
Acoustic Components
CMUT - Capacitive Micromechanical Ultrasonic Transducer
PMUT – A new generation of ultrasonic transducers
Printed Functionalities
Printed, flexible and hybrid electronics
Roll-to-roll printing machines, sheet format and printing on 3D objects
Printed Catalyst Coated Membrane (CCM) / MEA for their application in fuel cells and electrolyzers
Medical Systems and Smart Health
Microfluidic for Lab-on-Chip Systems
Theranostic Implants
Endostim
Devices for NeuroControl and NeuroRehabilitation (DeNeCor)
Project Apfel
M³Infekt
beforeFever
Test and Reliability Solutions
Reliability
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Reliability of Components and Systems
Data-based Methods
Acceleration through AI
Sensor-based data fusion
Demonstrator: Digital Twin Chemical Mechanical Polishing (CMP)
Integratable Spectral Sensing in Multi-Reactor Technology - Result Interpretation Using Neural Networks
AI-Supported Development of Electronic Systems for Future Vehicle Generations in the progressivKI Project
Implementation of a Novel Magnetic Field-Based Location Method Using AI
Cross-Functional Topics
FAB Management
Inline Metrology and Data
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Quantum Technologies
Photonic Integrated Circuits
Scaling of manufacturing capacity
Metalenses and Metasurfaces for Integrable Micro Optics
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