Events

The conference will cover all aspects of bonding wafers and comparable substrates, including chip to wafer bonding, from basic research to industrial applications.

Beside this general approach, the focus will be on the following topics this year:

• Fundamentals of wafer bonding and new developments in wafer and chip to wafer bonding
• Direct and surface activated wafer bonding at high and low temperatures
• Metal and glass-based bonding technologies
• Adhesive Wafer Bonding for permanent and temporary wafer bonding applications
• Hybrid bonding technologies
• System Integration by wafer and chip to wafer bonding and enabling new technologies and devices for
• Modern applications for electronics and multiphysics systems
• Metrology for bonding processes and bonded wafer stacks
• Wafer and chip to wafer bonding in industrial processes: processes stability and reliability
• The future of (wafer) bonding, new ideas approaches and applications