Fraunhofer Institute for Electronic Nano Systems

Fraunhofer ENAS - Your System and Technology Partner in the Field of Smart Systems Integration

The particular strength of the Fraunhofer Institute for Electronic Nano Systems ENAS lies in the development of smart integrated systems for different applications. Fraunhofer ENAS develops single components, technologies for their manufacturing as well as system concepts and system integration technologies and transfers them into production. The institute offers research and development services from the idea, via design and technology development or realization based on established technologies up to tested prototypes and technology transfer.

Focus on

Cutting-Edge Technologies for Advanced, Ultra-Precise Ultrasound

Testing and reliability assessment of semiconductor innovations as a future driver of technological progress

A holistic approach to global health: How the well-being of people and nature keeps our world in balance

Setting off into a green future with the packaging of efficient electronic power modules

On the Path to Green Energy with Smart Technologies and Components

Quantum Leap in Technology - Shaping the Future

Events

 

Chemnitz Seminar "Advanced Functional Materials and Methods for Neuromorphic Computing and Memory"

We invite you to the Chemnitz seminar on November 25 and 26, 2025. Discuss current issues on the topic with representatives from industry and academia.

 

Chemnitz Seminar "Sensor Systems for One Health"

We invite you to the Chemnitz seminar on September 2 and 3, 2025. Discuss current issues on the topic with representatives from industry and academia.

 

Science meets Art: "Peter Piek – Flugbahn"

We continue the series "Science Meets Art" with the exhibition "Peter Piek – Flugbahn".

 

We cordially invite you to the summer concert of the exhibition series on June 19, 2025, at 6 PM.

 

Events

Information on trade fairs, conferences, events, workshops and lectures

 

Fraunhofer ENAS will be present at the following trade fairs in the first half of 2025:

Sensor+Test | May 6-8, 2025
PCIM | May 6-8, 2025

News

 

New chapter for microelectronics in southeast Asia: Fraunhofer ENAS and Becamex IDC Corporation establish joint research center in Vietnam

 

Dr. Jochen Müller joins Fraunhofer ENAS as new head of “Process, Device and Packaging Technologies” business unit

“5 questions – 5 answers”: Interview with our new business unit head.

 

Parylene – an all-rounder: Ultra-thin polymer with protective properties

In this interview, Franz Selbmann explains what makes Parylene unique and what application potential the “talented” material offers.

 

Major Advancement in Applied Research: FMD Launches the Chiplet Application Hub

On March 31, 2025, at the Hannover Messe, the Research Fab Microelectronics Germany (FMD) officially unveiled its new Chiplet Application Hub

 

Faster, more powerful, more interconnected: KoVoPack project heralds a new era for mobile networks

The project develops a comprehensive technology platform that enables the efficient and cost-effective production of fully integrated electronic systems, known as "System-in-Package" (SiP) solutions.

 

Commitment to greater sustainability: Fraunhofer ENAS receives ISO 50001 certification

The certification confirms the institute's commitment to greater sustainability and the responsible use of resources. 

 

Thin Chips and Robust Substrates - Key Technologies for Cost-Efficient Silicon Carbide Power Electronics

"ThinSiCPower" is developing an alternative way to produce cost-effective SiC substrates and significantly thinner SiC chips.

 

Press and News

Current press releases and news from Fraunhofer ENAS

Cooperations

 

Cooperations within Fraunhofer

 

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