Fraunhofer Institute for Electronic Nano Systems

Fraunhofer ENAS - Your System and Technology Partner in the Field of Smart Systems Integration by using Micro and Nano Technologies

The particular strength of the Fraunhofer Institute for Electronic Nano Systems ENAS lies in the development of smart integrated systems for different applications. Fraunhofer ENAS develops single components, technologies for their manufacturing as well as system concepts and system integration technologies and transfers them into production. The institute offers research and development services from the idea, via design and technology development or realization based on established technologies up to tested prototypes.



Virtual Showroom

Discover the virtual showroom of the High-Performance Center  »Functional Integration in Micro and Nanoelectronics« and find out more about our competences and technologies.


Combining expertise in research and development for microelectronics in Saxony

Following a decision by the Executive Board of the Fraunhofer-Gesellschaft, the HighPerformance Center "Functional Integration for Micro/Nanoelectronics" is being funded for another three years. The center will receive annual funding of €1 million from the Fraunhofer Society for the period from 2022 to 2024.


Technologies for the production of printed functionalities on 3D objects

The Fraunhofer Institute for Electronic Nano Systems ENAS is presenting printing technologies for functionalizing 3D objects at this year‘s LOPEC and InPrint in Munich. At the booth, the research team will show a robot setup with an integrated print head for inkjet printing and functionalized prototype of a large-area heating structures for seats.





Inductive bonding – A new bonding method in microsystems technology

Fraunhofer ENAS shows a new bonding process at the MEMS Sensing & Network System 2022 in Tokyo. Together with the Japanese company SHINKO, inductive bonding is offered especially for power electronics components.




Fraunhofer Competence Forum China

Fraunhofer invites to the Fraunhofer Competence Forum China on April 14, 2022.

Within this webinar »Challenges and Opportunities of the Semiconductor Industry« Fraunhofer experts will present the innovative technologies of RISC-V based SoC Design, Fan-Out System Packaging, Electronic Integration and Packaging in the semiconductor field.


Fraunhofer ENAS at Trade Fairs in 2022

HANNOVER Messe in Hannover/Germany | May 30 - Jun 2, 2022

FC³ Fuel Cell Conference Chemnitz in Chemnitz/Germany | May 31 - Jun 1, 2022

techtextil | in Frankfurt/Germany June 21-24, 2022

COMPAMED in Duesseldorf/Germany |
Nov 14-17, 2022

SEMICON Europa in Munich/Germany |
Nov 15-18, 2022


Online Exhibition »NATUR - MENSCH - TECHNIK 2021« by Ines Escherich

The current exhibition of the Chemnitz photographer Ines Escherich shows photographs under the title "Nature - Human - Technology 2021".

Due to the current restrictions we show the exhibition online for the first time.





High-Performance Center »Smart Production and Materials«


Research Fab Microelectronics Germany (FMD)


High-Performance Center »Functional Integration of Micro and Nanoelectronics«


Fraunhofer ENAS Annual Report and R&D Service Brochure