Hilton Hotel, Dresden/Germany / January 28, 2019 - January 30, 2019
3D & Systems Summit 2019
From 3D Technologies to Heterogeneous Integration and High-Density Systems for Different Applications
Booth 1 (Joint booth with Fraunhofer IZM)
From 3D Technologies to Heterogeneous Integration and High-Density Systems for Different Applications
Booth 1 (Joint booth with Fraunhofer IZM)
SEMI Europe invites to the »3D & Systems Summit« with conference and accompanying exhibition from January 28 until 30, 2019, to Dresden, Germany. According to the theme »From 3D Technologies to Heterogeneous Integration and High-Density Systems for Different Applications«, 3D integration and systems are discussed with regard to technological aspects and applications.
Fraunhofer ENAS shows R&D results of 3D integration technologies and MEMS applications togehter with Fraunhofer IZM at booth 1.