APECS – Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems

The pilot line for “Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems” (APECS) marks a major leap forward in strengthening Europe’s semiconductor manufacturing capabilities and chiplet innovation as part of the EU Chips Act. By providing large industry players, SMEs, and start-ups with a facilitated access to cutting-edge technology, the APECS pilot line will establish a strong foundation for resilient and robust European semiconductor supply chains. Within APECS, the institutes collaborating in the Research Fab Microelectronics Germany (FMD) will work closely with European partners, to make a significant contribution to the European Union´s goals of increasing technological resilience, strengthening cross-border collaboration and enhancing its global competitiveness in semiconductor technologies.

 

How Fraunhofer ENAS advances innovation within APECS

Within the APECS pilot line, Fraunhofer ENAS contributes technological expertise in three key areas: System Technology Co-Optimization (STCO) design development, advanced manufacturing for interposer and chiplet integration, as well as comprehensive characterization, test and reliability (CTR) methodologies:

Design: Fraunhofer ENAS provides designs for 2.5D/3D heterogeneous integration, contributing to PDKs/ADKs, as well as modeling for the numerical optimization of manufacturing processes.

Process side: Its activities focus on the fabrication of electrical, optical, and mechanical interconnections between chiplets as well as between chiplets and interposers. A key objective is advancing chip-to-wafer and wafer-to-wafer bonding to achieve higher integration densities while ensuring reliable bonding across novel material combinations.

CTR: To ensure functionality and reliability, Fraunhofer ENAS works on developing a broad spectrum of characterization, testing, and reliability methods, including 2.5D/3D and optical tests, electrostatic sensitive device (ESD) and electromagnetic compatibility (EMC) reliability testing, as well as analyzing thermomechanical reliability aspects – complemented by modeling and numerical reliability evaluations.

These activities contribute to building the technological foundation for next-generation heterogeneous integration. Within APECS and as part of Research Fab Microelectronics Germany (FMD), Fraunhofer ENAS collaborates with other European RTOs, combining expertise and infrastructure to drive innovation in heterogeneous integration and advanced packaging, while reinforcing Europe’s technological resilience and competitiveness.

APECS is co-funded by the Chips Joint Undertaking and national funding authorities of Austria, Belgium, Finland, France, Germany, Greece, Portugal, Spain, through the “Chips for Europe” initiative. The overall funding for APECS amounts to €730 million over 4.5 years.