Analytics/Characterization

Preparation techniques for analytics

• Focused ion beam (FIB)
• Preparation for micrograph sections
• Sputtering: carbon, metals

 

Process-accompanying analytical methods

• Profilometry: tactile, optical (Datac, AFM, reflectometer, white light)
• XPS: surface, depth profile
• Wafer thickness
• Sheet resistance
• Wafer bow measurement
• Adhesion tests: 4 point bending
• Life time scanner
• Thermogavimetric analysis and differential scanning calorimetry
• (in situ) XPS spectroscopy
• (in situ) Raman spectroscopy

 

In situ plasma diagnostics for process optimization

• Optical emission spectroscopy
• Quadrupol mass spectrometry
• Quantum cascade laser absorption spectroscopy
• Langmuir probe

 

Optical inspection

• Spectroscopy: EDX, IR, FTIR, NIR, UV/Vis, fluorescence, Raman, spectral ellipsometry
• Microscopy: light, SEM, SEM/FIB, AFM, TEM, SAM, laser scanning, thermographic
• X-ray computer tomography
• White light interferometry

 

Bond quality evaluation

• Bonding strength
  • Micro Chevron test (MCT)
  • Pull test
  • Razorblade test
  • Compression shear test
• Nondestructive analysis
  • IR and ultrasonic microscopy
• Hermeticity
  • Helium leakage test
  • FTIR spectroscopy
  • Micro resonator

 

Failure analysis, material modeling and deformation analysis

• Chemical and structural analysis of materials: SEM with EDX, EBSD, 3D EDX, 3D EBSD, cross-section and optical microscopy
• Physics failure analysis: 3D computer tomography, scanning accoustic
• Thermo-mechanical material characterization: Young's modulus, coefficient of thermal expansion (CTE)
• Elastic-plastic and creep characterization of bulk materials and thin films (-70  °C - 500 °C) by nanoindenter or shear test
• Visco-elastic characterization – DMA, TMA, TGA-SA (humidity): Master curve (time, temperature, humidity) based on the time temperature superposition principle and visco-elastic material model for Ansys and Abaqus
• Determination of fracture mechanics parameters for critical and sub-critical crack growth (-40 °C - 200 °C)
• in situ 3D warpage, deformation and strain measurements of 1 x 1 mm² to 300 x 300 x 100 mm² objects by chromatic sensor, white light interferometry, confocal microscopy and in-plane gray scale image correlation (microDAC) in air, N₂ or Ar between -80 °C and 400 °C with sub-micron resolution
• Micro and nano hardness and strength testing on thin films, MEMS structures and membranes
• Determination of rsidual mechanical stresses in BEOL thin films and MEMS structures with highest spatial resolution (down to 250 nm in-plane and 50 nm in depth) using fibDAC

 

Electrical characterization

• Antenna measurement and characterization
• RF network and spectrum analysis
• EM near field characterization
• Wafer probe: current-voltage, capacity-voltage, biased temperature stress, TVS measurements, mercury probe
  • Current-voltage
  • Capacity-voltage
  • Biased temperature stress
  • TVS measurements
  • Mercury probe