We offer application-oriented design starting from the concept via component to device and system, while taking design for reliability into account.
MEMS/NEMS
- Inertial sensors
- RF MEMS
- MOEMS
Materials, processes and equipment for micro and nanoelectronics
- Multi-scale simulation of thin film deposition (PVD, CVD, ALD, ECD) for process and reactor optimization
- Simulation of surface chemistry and film growth
- Structural, thermal, mechanical and electronical properties of thin films and nano materials
Electronics and communication
- Analog and digital circuits and mixed signal
- PCB layout
- Basic software programming
- RF circuit design
- Antenna design for data and energy transmission
Electrical and multi-physical systems
- Electro-mechanical coupling
- Modeling, simulation and measurement of parasitic electromagnetic effects
- Structural analyses
- Thermo-mechanical induced packaging stress
- Chip, packages, modules, PCB
Micro and nano devices and systems
- Thermal and electrical simulation of ULSI interconnect systems
- TCAD simulation of strained ULSI transistors
- Multi-scale modeling of CNT FETs
- Ab initio simulation of electron transport in nanostructures
- Modeling of sensors based on nanomaterials
- Mask design, layout, technology support
- Electromagnetic simulations of antennas and systems
- Methodologies for multi-scale modeling of NEMS
- Electromagnetic simulations of RF MEMS components
Fluidic systems
- Liquid-based microfluidic systems
- Gas-based microfluidic actuators
Reliability
- Analysis, assessment and prediction of reliability
- Mechanical and thermoelectromechanical
- Crack and fracture modeling
- Multi-field effects
- Validation via coupling of simulation and experiments
- Fracture and damage mechanics (mm ... sub-nm)
- Cohesive zone modeling (CZM)
- Extended FEM (X-FEM)
- Life-time prognosis
- Virtual prototyping, robustness analysis and optimization
- Electromagnetic reliability analysis
- Near field localization of hot spots
- Near field/far field transformation