Design, Simulation and Modeling

The design of micro- and nanosystems is one of our core strengths. We take an application-oriented approach, guiding your vision from the initial concept to a fully functional demonstrator or prototype.

Our expertise extends beyond design to advanced multi-scale and multiparametric modeling of Micro and Nano Electro Mechanical Systems (MEMS and NEMS). Using cutting-edge tools like ANSYS, Matlab, Comsol, and Python libraries, we optimize system behavior across scales and physical domains, ensuring superior performance and reliability.

We integrate electronics, reliability considerations, and testing at various levels into the design process. Additionally, we develop firmware and evaluation software to support your system's functionality.

Our team creates mask-ready layouts tailored to specific technological processes or develops custom processes when required. We ensure a seamless flow from mask design to layout-conformal simulation and finally to physical structures.

To streamline repetitive structures, we leverage automated parametric layout generation, saving time and reducing errors. Automatic DRC (Design Rule Check) procedures ensure compliance with fabrication technology requirements, preventing potential manufacturing issues.

For RF-MEMS components, we utilize advanced electromagnetic simulation tools (ANSYS HFSS, CST Studio Suite, Comsol Multiphysics) to optimize signal transmission, power handling, and minimize coupling and parasitic effects.

We also provide extensive support in selecting the most suitable micro- or nanofabrication technology, considering material and process compatibility.

 

MEMS/NEMS

  • Inertial sensors (e.g., gyroscope, accelerometer, inclinometer)
  • RF MEMS (e.g., switch, varactor)
  • MOEMS (e.g., filter, deflector, 1D and 2D mirrors, Fabry-Perot Interferometer (electrostatic, piezoelectric, thermal), MEMS actuators
  • Capacitive and piezoelectric ultrasonic transducers (CMUT, PMUT)
  • System simulation of component and sub-components (Matlab, Simulink, Python, LT-SPICE)
  • Digital twins for components and processes

 

Materials, processes and equipment for micro and nanoelectronics

  • Multi-scale simulation of thin film deposition (PVD, CVD, ALD, ECD) for process optimization and virtual prototyping - from physics-based to surrogate models
  • Simulation of surface chemistry and film growth
  • Structural, thermal, mechanical and electronical properties of thin films and nano materials
  • Knowledge-based process models to combine empirical and expert knowledege, known process data and physics models
  • Digital twins and optimization procedure for technological processes

 

Electronics and communication

  • Design for application-specific harsh environments
  • EMC-compliant design
  • Analog and digital circuits and mixed signal
  • PCB layout
  • Software and firmware programming (GUI, PC interface, smartphone app)
  • RF circuit design
  • Antenna design for data and energy transmission
  • Coil design for energy transmission
  • Integration of measurement setups in CAD environments for further design needs
  • AI-based simulation and modeling

 

Electrical and multi-physical systems

  • Electro-mechanical coupling
  • Parasitic electromagnetic effects
  • Structural analyses
  • Thermo-mechanical induced process and packaging stress
  • Chip, packages, modules, PCB design and optimization

 

Systems with micro and nano devices 

  • Multi-scale modeling and simulation of emerging nanodevices (CNT FETs, nanowire FETs, memristors)
  • Ab initio simulation of electron transport in nanostructures
  • Network models for graphene-based conductore materials
  • Mask design, layout, technology support, DRC, automatic parametric layout generation   
  • Electromagnetic simulations of antennas and systems
  • Methodologies for multi-scale and multi-parametric modeling of MEMS and NEMS
  • Electromagnetic simulations of RF MEMS components

 

Photonic integrated circuits

  • Couplers
  • Waveguides
  • Resonators
  • Phase shifters

 

Fluidic systems

  • Liquid-based microfluidic systems
  • Transient thermal analysis of fluid systems and their optimization

 

Reliability

  • Analysis, assessment and prediction of reliability
    • Mechanical and thermo-electro-mechanical
    • Crack and fracture modeling
    • Multi-field effects
    • Validation via coupling of simulation and experiments
  • Fracture and damage mechanics (mm to sub-nm)
    • Cohesive zone modeling (CZM)
    • Extended FEM (X-FEM)
  • Life-time prognosis
  • Digital twins, robustness analysis and optimization
  • Electromagnetic compatibility and reliability analysis
  • Near field localization of hot spots
  • Near field/far field transformation