H-06 (Fraunhofer-Stand gemeinsam mit Fraunhofer IZM und Fraunhofer IPMS)
Unterstützend zu unseren Vorträgen und Postern zeigen wir in der Ausstellung am Stand H-06 hochpräzise Sensorsysteme, gedruckte Funktionalitäten und Technologien zum Waferbonding.
Mehr über unsere Forschungsthemen erfahren Sie in den Vorträge des Fraunhofer ENAS:
Mi, 10. April 2019
Session: Design of Smart Integrated Systems
Low Power High Bandwidth Acceleration Sensors
Dr. Roman Forke, Fraunhofer ENAS
Mi, 10. April 2019
Session: Test and Reliablity
The Creation of a Validated Scheme for the Automated Optimiziation of Systems in Package Designs
Ghanshyam Gadhiya, Fraunhofer ENAS
Mi, 10. April 2019
Session: Smart Low Cost Approaches
Joining Two Worlds - Hybrid Integration of Silicon based Electronics and Printed Functionalities
Frank Roscher, Fraunhofer ENAS
Mi, 10. April 2019
Co-located event: Smart Systems HUB Session
Advanced Sensor Systems for Condition Monitoring in Industrial Applications
Dr. Danny Reuter, Fraunhofer ENAS / Leistungszentrum »Funktionsintegration für die Mikro-/Nanoelektronik«
Do, 11. April 2019
Session: System Integration II
Fabrication of Nano Porous Gold on Wafer Level for Thermocompression Bonding
Silvia Hertel, Fraunhofer ENAS
Do, 11. April 2019
Session: Smart Production
Printing Beyond Color - Towards the Integration of Digital Printing and Laser Technics into General Manufacturing Environments
Prof. Reinhard R. Baumann, Fraunhofer ENAS
Postersession
Mi, 10. April 2019, 15:25 Uhr - 16:25 Uhr
Do, 11. April 2019, 13:45 Uhr - 15:00 Uhr
Inkjet-Printed Wireless Chemresistive Sensors
Melinda Hartwig, Fraunhofer ENAS
Integration of Plasmonic Nanostructures for Micro-Optoelectro-Mechanical Systems
Dr. Georg Heldt, Fraunhofer ENAS
Method of Superposing a Multiple Driven Magnetic Field to Minimize Stray Fields Around the Receiver for Inductive Wireless Power Transmission
Sven Lange, Fraunhofer ENAS
Fraunhofer-Institut für Elektronische Nanosysteme