| Mittwoch | 6. Mai 2026 | 12:30 - 21:00 UHR |
| 12:30 – 12:50 Uhr |
Begrüßung
(Prof. Dr. Harald Kuhn und Dr. Maik Wiemer, Fraunhofer ENAS) |
| 12:50 - 13:20 Uhr |
Opener
Automotive Industry Trends and Opportunities
(Nihat Küçük, Motherson Innovations Deutschland GmbH) |
| Session 1: Devices |
| 13:20 – 13:55 Uhr |
Next-Generation Optical Sensing: Broadcom’s IFPD - Product and Packaging Portfolio
(Frank Becker, Broadcom) |
| 13:55 – 14:20 Uhr |
Ultrasound-Based Sensing Systems: From Human–Machine Interfaces to Microelectronic Inspection
(J.-Prof. Dr.-Ing. Christian Kupsch, TU Bergakademie Freiberg)
|
| 14:20 – 14:45 Uhr |
Reverse Engineering and Failure Analysis with Ion Beam Etching
(Stefanie Rumbke, scia Systems GmbH) |
| 14:45 – 15:15 Uhr |
Kaffeepause |
| Session 2: Additive Technologien |
| 15:15 – 15:40 Uhr |
Inkjet additive processes in semiconductor manufacturing
(Dr. Kai Keller, Notion Systems GmbH) |
| 15:40 – 16:05 Uhr |
Packaging everything everywhere. Advantages and challenges in AM-integrated electronics
(Florens Wasserfall, Kronos) |
| 16:05 – 16:30 Uhr |
Micro Transfer Printing: an overview on application to integrated photonics
(Dr. Ruggero Loi, X-Celeprint) |
| 16:30 – 16:55 Uhr |
Two-Photon Polymerization (2PP) - Availabe Technology at Fraunhofer ENAS
(Valeri Fitz, Fraunhofer ENAS) |
| 16:55 – 17:30 Uhr |
Kaffeepause |
| 17:30 – 18:00 Uhr |
Ideen-Pitches
|
| 18:00 – 21:00 Uhr |
Get together / Networking |
| Donnerstag | 7. Mai 2026 | 9:00 - 15:30 UHR |
| 09:00 – 09:10 Uhr |
Begrüßung
(Dr. Maik Wiemer, Fraunhofer ENAS) |
| 09:10 – 09:40 Uhr |
Opener
From Foundry to Customer Application: Supply Chain and Packaging in a Fabless ASIC Business Model
(Dr. Detlef Billep, EDC Electronic Design Chemnitz GmbH) |
| Session 3: Prozesstechnologien |
| 09:40 – 10:05 Uhr |
Progress in Al-plating and bi-/multilayer stacking with Almight® & MeltMatic®
(Mike Becker, NB Technologies GmbH) |
| 10:05 – 10:30 Uhr |
Metallizations and solder joints from the perspective of a materials scientist
(Dr.-Ing. Martin Seyring, Hochschule Schmalkalden) |
| 10:30 – 11:00 Uhr |
Kaffeepause |
| Session 4: Bondingtechnologien |
| 11:00 – 11:25 Uhr |
Die-2-Wafer Bonding - Recent Advances and Challenges for Heterogenous Integration
(Tobias Wernicke, EV Group) |
| 11:25 – 11:50 Uhr |
Fluxless thermo-compression bonding for high density integration
(Dr. Martin Kainz, Besi) |
| 11:50 – 12:15 Uhr |
tbc
(Harry Chou, PulseForge) |
| 12:15 – 13:15 Uhr |
Mittagspause |
| 13:15 – 13:40 Uhr |
Characterization of Electroplated Barrier Metals for Advanced Packaging
(Dr. Tsvetina Dobrovolska, Umicore Galvanotechnik GmbH) |
| 13:40 – 14:05 Uhr |
Surface-activated bonding of amorphous wafer substrates at room temperature via Al2O3 atomic-level contact formation
(Alexander Spatzig, Nidec Drive Technology Europe GmbH - Machine Tool Division) |
| 14:05 – 14:30 Uhr |
Beyond Conventional Bonding: Laser-Assisted Interconnect Solutions for Next-Generation Electronic Packaging
(Dr. Clemens Wesseling, Pac Tech - Packaging Technologies GmbH) |
| 14:30 – 14:40 Uhr |
Verabschiedung
(Dr. Maik Wiemer, Fraunhofer ENAS) |
| 14:45 – 15:30 Uhr |
Individuelle Labtouren |
Fraunhofer-Institut für Elektronische Nanosysteme