Technologies

MEMS and MOEMS technologies

• High aspect ratio (HAR) technologies for high-precision capacitive MEMS: Airgap Insulation of Microstructures (AIM), Single Crystal Reactive Etching and Metallization (SCREAM), Bonding and Deep Reactive Ion Etching (BDRIE)
• Bulk technologies
• Piezo-MEMS technologies
• Thin film encapsulation
• MEMS packaging and 3D integration

 

Back-end of line technologies for micro and nano electronics

• Copper metallization (barrier, seed, fill)
• Low-k and ULK dielectrics (processes, integration)
• New materials and thin film processes
• Development and conceptual design of integration schemes
• Modeling and simulation of processes and equipment
• CNT-based interconnects

 

Fluidic integration technologies

• Prototyping and assembling of (micro)fluidic systems
• Peripheral systems (instruments, electronics, software)
• Microfluidic systems based on silicon, glass, polymers, metals
• Liquid-based microfluidics
  • (Bio)sensor integration
  • Assay integration
  • Integration of actuators (micro pumps, valves, heater)
• Gas-based microfluidics
  • Synthetic jet actuators (SJA)
  • Pulsed jet actuators (PJA)
  • Prototyping and assembling of gas-based microfluidics for wind tunnel tests

   

Nano integration technologies

• Nano lithography
  • Electron beam lithography
  • Nano imprint lithography
• Layer-based technologies
  • Nanocomposites (semiconducting metal oxides, quantum dot-based layers)
  • Magnetic field sensors (multi-dimensional GMR sensors, microstructuring, laser annealing)
  • Memristive components (functional multilayers, circuit technologies)
• 1D technologies
  • CNT functionality on wafer-level (coating, patterns, heterogenous integration)
  • CNT material: type-selective CVD, material purification, assembly
  • CNT-based piezoresistive sensor
  • CNT-based FETs for sensors
  • CNT-FETs for high-frequency applications

   

Printing technologies

• Sheet- and web-based printing processes up to pilot scale (inkjet, screen printing, gravure, dispensing)
• Printing of functional inks on flexible and rigid substrates with 2D and 3D surfaces
• Functionality formation by sintering of printed patterns
• Integration of printing technologies in manufacturing environments
• Design and printing-based manufacturing of tailor-made flexible thin film batteries
• Design, simulation, printing and characterization of customized antennas (RFID, WLAN, Bluetooth, LTE, UMTS,...)