Technologies

High aspect ratio (HAR) technologies for high-precision capacitive MEMS: Bonding and Deep Reactive Ion Etching (BDRIE)
Bulk technologies
Piezo-MEMS technologies
Thin film encapsulation
MEMS packaging and 3D integration

High density copper interconnects for hybrid bonding
New materials and thin film processes
Development and conceptual design of integration schemes
Modeling and simulation of processes and equipment
Integration of Graphene for horizontal wiring
Integration of CNT-FET module for post-BEOL embedded electronic functionality and 3D integration

Prototyping and assembling of (micro)fluidic systems
Peripheral systems (instruments, electronics, software)
Microfluidic systems based on silicon, glass, polymers, metals
Liquid-based microfluidics
- (Bio)sensor integration
- Assay integration
- Integration of actuators (micro pumps, valves, heater)

Nano lithography
- Electron beam lithography
- Nano imprint lithography
Layer-based technologies
- Nanocomposites (semiconducting metal oxides, quantum dot-based layers: LEDs (Vis-NIR))
- Magnetic field sensors (multi-dimensional GMR sensors, microstructuring, laser annealing)
- Memristive components (functional multilayers, circuit technologies)
1D and 2D nanomaterials on wafer-level and special substrates
Nano device integration steps: structuring, cleaning, contacting, functionalization, passivation
Vertically-aligned CNTs (VACNT) with CVD and transfer (at room temperature)
Preparation of flexible foils and membranes with nanostructured C-electrodes
Graphene integration from dispersion and transfer
Integration of electronic grade semiconducting SWCNTs
Technology for suspended nanodevices
Surface technology for strain-controlled nanomaterials
Technology for heterogeneous systems (e.g., MEMS/CNTFET)
Specific development of nanodevice technologies (e.g., quantum applications)
Analytics: Waferscale analytics for nanostructures and nanodevices (AFM, Raman spectroscopy, semiconductor parameter analysis)

Sheet- and web-based printing processes up to pilot scale (aerosol jet, dispensing, gravure, inkjet, piezo jetting, screen printing, stencil printing)
2D and 3D surface functionalization by
- Printing of functional inks single/multi-layer on flexible and rigid substrates
- Functionality formation by post-treatment of printed patterns
  - Sintering (i.e., IR, intense pulsed light, thermal, laser)
  - UV curing
Application printing technologies for system packaging
- Printing of inks/solder materials as
  - Intermediate layer for chip and waferlevel bonding
  - Dielectric barrier for surface passivation/encapsulation
  - Intermediate layers for power electronics
Integration of printing technologies in manufacturing environments
- Design and printing-based manufacturing of tailor-made flexible thin film batteries
- Design, simulation, printing and characterization of customized antennas (RFID, WLAN, Bluetooth, LTE, UMTS etc.)
- Design and printing of glass frit based intermediate layers for high throughput waferlevel bonding

We develop
- Wafer-level integration technologies for neuromorphic computing
- Components and technologies for utilizing quantum effects, quantum computing and quantum sensing
Focus areas
- Wafer technologies with special deposition and structuring processes (e.g., nanostructured crossbar arrays, integrated quantum dots, BFO layers)
- Wafer technologies for the integration of quantum dots (e.g., LEDs, single-photon sources)
- Packaging technologies for complex and highly integrated quantum chips (e.g., ion traps, single-photon sources)
- Micro and nanostructured optical components (e.g., metalenses, photonic integrated circuits)
- Consideration of aspects of thermomechanical reliability under cryognic conditions

SEM image of a gyroscope structure