Dienstag | 13. Mai 2025 | 12:30 - 17:05 UHR |
12:30 – 12:40 Uhr |
Begrüßung (Dr. Maik Wiemer, Fraunhofer ENAS) |
12:40 – 13:05 Uhr |
Fine grain copper deposition for next generation 3D advanced packaging applications (Dr. Dirk Tews, Atotech Deutschland GmbH Co. KG) |
13:05 – 13:30 Uhr |
Microchannel particle deposition for MEMS & sensors applications (Thomas Russell, Mesoline) |
13:30 – 13:55 Uhr |
Design rule based modularisation and realisation of additively manufactured electrical structures (Lukas Hauck, Hochschule Schmalkalden) |
13:55 – 14:20 Uhr |
Recent developments in wire bonding and testing (Dr. Bernhard Rebhan, F&S BONDTEC Semiconductor GmbH) |
14:20 – 15:00 Uhr |
Kaffeepause |
15:00 – 15:25 Uhr |
Surface charges in nanofluidics and nanosensors (Dr. Pal Arki, Technische Universität Bergakademie Freiberg, Institut für Nanoskalige und Biobasierte Materialien) |
15:25 – 15:50 Uhr |
Gas content analysis of wafer bonds: effects of treatments on the bond atmosphere (Marcus Daniel / Christian Tschernatsch, Zentrum für Glas- und Umweltanalytik GmbH) |
15:50 – 16:15 Uhr |
Sintering technology in power electronics (Dr. Jacek Rudzki, Semikron Danfoss GmbH) |
16:15 – 16:40 Uhr |
Integration of sensor modules (József Tóth, Hepenix) |
16:40 – 17:05 Uhr |
Bumping for chip integration (Imants Cirulis / Datta Sai Kalangi, Fraunhofer-Institut für Elektronische Nanosysteme ENAS) |
Mittwoch | 14. Mai 2025 | 8:30 - 16:00 UHR |
08:30 – 08:40 Uhr |
Begrüßung (Dr. Maik Wiemer, Fraunhofer ENAS) |
08:40 – 09:05 Uhr |
UHV exfoliation and functionalization of 2D materials (Dr. Martin Kalbáč, J. Heyrovský Institute of Physical Chemistry) |
09:05 – 09:30 Uhr |
Optical properties of integrated electrically biased suspended graphene membranes – simulation and characterization (Dr. Anna Kozłowska, Łukasiewicz Research Network – Institute of Microelectronics and Photonics) |
09:30 – 09:55 Uhr |
Characterization of optical radiation sources in terms of basic photometric and radiometric parameters (Dr. Andrzej Rybczynski, GL Optic) |
09:55 – 10:45 Uhr |
Kaffeepause |
10:45 – 11:10 Uhr |
High-density D2W hybrid bonding technology for chiplet integration (Prof. Dr.-Ing. Juliana Panchenko, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM) |
11:10 – 11:35 Uhr |
Surface activated bonding und MEMS packaging (Alexander Spatzig, Nidec Drive Technology Europe GmbH – Machine Tool Division) |
11:35 – 12:00 Uhr |
IR-based Laser De-Bonding for FEOL Process Integration (Tobias Wernicke, EV Group) |
12:00 – 13:00 Uhr |
Mittagspause |
13:00 – 13:25 Uhr |
Wafer-level bonding of quartz and silicon for UV applications (Dr. Ulli Hansen, MSG Lithoglas GmbH) |
13:25 – 13:50 Uhr |
Arbeitstitel: Integrationstechnologien für Ionenfallen (Claus Gärtner, Eleqtron) |
13:50 – 14:15 Uhr |
Diskussion |
ab 14:30 Uhr |
Individuelle Labor- und Window-Touren |