Client-oriented Application of technologies and processes

With the available equipment standard semiconductor and MEMS processes can be carried out as customers order or also as second source. A major advantage is that technologies and processes can be arranged and performed customer-specific according to the respective requirements. In the research fields of wafer bonding, MEMS/NEMS packaging and integration of complex micro systems we also offer feasibility and market analyses, ..., train the staff of companies in-house or also within their facilities and last but not least transfer new technologies and processes to the partner’s fab. Further information and dates are available upon request.

Technologies and processes



Silicon direct bonding, anodic bonding, glass frit bonding, eutectic bonding, adhesive bonding, thermo-compression bonding, laser assisted bonding, reactive bonding



Si, glass, ceramic, metal, special materials, joints (e.g. Si-glass, glass-glass, Si-Si)


Chip bonding

Flip-Chip, Chip-to-Chip (C2C), Chip-to-Wafer (C2W), Multi-Chip-Module (MCM), Chip-on-Board (COB), Surface-mounting technology (SMT)


Wire bonding

Bonding with thin and thick wires (32…250 µm), ultrasonic bonding, thermo-compression bonding, thermosonic bonding


Surface modification

Surface activation with CMP and plasma


Surface structuring

Wet/dry etching, laser structuring, nano structuring, nano lawn, reactive nano layer systems, nano-imprint lithography, micro molding


Layer deposition

PLD, PVD, ECD, spray coating, spin coating, screen printing, aerosol jet printing, dispensing


Hermeticity, bond strength, IR inspection, SAM, REM, FIB, EDX