With the available equipment standard semiconductor and MEMS processes can be carried out as customers order or also as second source. A major advantage is that technologies and processes can be arranged and performed customer-specific according to the respective requirements. In the research fields of wafer bonding, MEMS/NEMS packaging and integration of complex micro systems we also offer feasibility and market analyses, ..., train the staff of companies in-house or also within their facilities and last but not least transfer new technologies and processes to the partner’s fab. Further information and dates are available upon request.
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Silicon direct bonding, anodic bonding, glass frit bonding, eutectic bonding, adhesive bonding, thermo-compression bonding, laser assisted bonding, reactive bonding