Fraunhofer Institute for Electronic Nano Systems
Fraunhofer Institute for Electronic Nano Systems

Layer deposition

Layer deposition techniques at Fraunhofer ENAS can be distinguished between thick film and thin film methods. In thin film processing, layers of thicknesses in nanometer or lower micrometer range respectively are deposited onto various substrates. In the area of thick film processing, traditionally printing techniques for layers of thicknesses from 10 µm to 25 µm are deposited onto substrates. Various technologies and standard equipment are available for both techniques.

Thin film deposition

In thin film processing, materials like metal or insulators are deposited as layers onto various substrates (e.g. silicon, glass, ceramics) by (electro-) chemical or physical processes. By physical vapor deposition (PVD) materials like aluminum, copper, metallic glasses, palladium, silicon, titanium or zirconium can be deposited onto substrates. By electro chemical deposition (ECD) thin layers can be deposited from aqueous and ionic solutions. Research in the area of aqueous electrolytes focuses on the deposition of pure layers (e.g. Pd, Sn or Zn) on the one hand as well as mixed layers (e.g. SnAg) on the other hand. The research on deposition from ionic liquids focuses on deposition of aluminum at nearly room temperature.

Depositable materialis

  • PVD
  • Al, Cu, Ti, Pd, Si, Zr, metallic glasses
  • ECD
  • Ni, Pd, Sn, SnAg

Substrates

  • Wafer (e.g. silicon, glass)
  • Rectangular substrates (e.g. ceramics)
  • Circuit boards
  • Other substrates upon request

Thick film deposition

In the field of thick film techniques, metallic layers as well as insulation layers are deposited onto substrates (e.g. silicon, glass, ceramic and polymer foils) by printing techniques. Metallic layers (like copper, silver, gold and soft solder) can be deposited precisely onto substrates with various geometrical dimensions by screen printing and aerosol jet technology. Insulation layers (e.g. photoresists, glass frit paste, dielectrics) can be deposited using aerosol jet technology, screen printing, spin-on-coating and spray coating.

Depositable materials

  • Screen printing
  • Metals (Cu, Sn, SnAg, SnAgCu)
  • Glass frit paste
  • Aerosol Jet
  • Ag, Au, Cu, Pt
  • Dielectrics
  • Resist coating
  • Positive and negative photoresists

Substrates

  • Wafer (e.g. silicon, glass)
  • Rectangular substrates (e.g. ceramics)
  • Circuit boards
  • Other substrates upon request