Fraunhofer Institute for Electronic Nano Systems
Fraunhofer Institute for Electronic Nano Systems

System Packaging

Service: Characterization

The analysis of the bond interface or intermediate layer is an essential part in the development and improvement of new and already applied bonding technologies. Due to the long experience and well-equipped facilities, the Fraunhofer ENAS offers a wide range of services for an extensive characterization of the bond interface or intermediate bond layers. In addition to non-destructive methods for the in-line detection of bond defects, different test setups for the evaluation of the hermeticity and mechanical strength are available.

 

Non-destructive detection of bond defects  (in-line monitoring)

 

Infrared microscopy

  • Analysis of silicon based packages on chip and wafer level
  • Detection of cracks, voids and particles
  • Scanning acoustic microscopy (PVA TePla SAM 300E ):
  • Characterization of wafer stacks with and without intermediate metal layer
  • Detection of cracks, voids and particles and delaminated areas
  • Analysis of the different interfaces in wafer stacks consisting of more than two substrates

Helium leak test (MIL-STD)

  • Design of test structures with an encapsulated volume ≥ 20 mm³
  • Detectable leak rate: > 10-9 mbar∙l/s
  • Sensitivity: 2∙10-10 mbar∙l/s

FTIR spectroscopy

  • Design of test structures with an encapsulated volume ≥ 5 mm³
  • Analysis of the change in the optical transmission with and without tracer gas
  • Detectable leak rate: 10-11… 10-15  mbar∙l/s

Micro resonator

  • Design of micro resonators with an encapsulated volume ≤ 5 mm³
  • Detectable leak rate: ≥ 10-16  mbar∙l/s
  • Sensitivity: 10-10… 10-11 mbar∙l/s

 

Mechanical strength

 

Compression shear test (TIRA test 2805)

  • Design of test structures fort he evaluation oft he shear strength
  • Measurement of shear strength for test samples and fully processed devices
  • Analysis of packages chips with and without intermediate layers
  • Enables combined analysis of bonding strength and hermeticity

Micro-Chevron-Test (application oriented test system)

  • Hybrid method combining finite element analysis with experiment
  • Determination of fracture toughness and energy release rate
  • Design of special test geometries
  • Determination of required parameters by finite element method
  • Analysis of bonding technologies with and without intermediate layers