Fraunhofer Institute for Electronic Nano SystemsWire bonding techniques are used for the electrical interconnection of micro mechanic and electronic components after the production process on a redistribution layer or the components among themselves. Fraunhofer ENAS is equipped with tools for thermosonic wire bonding, thermocompression bonding as well as thermosonic bonding. Different gold, aluminum as well as copper wire with different diameters (ranging from 18 µm to 50 µm) can be used. In addition to that, ball/wedge as well as wedge/wedge and stud bumping methods are possible. Furthermore, different types of substrates such as electronics and ceramics can be wire bonded. Wire bonding is possible for manufacturing of prototypes and small series.
Wire bonding technologies
- Thermosonic wire bonding
- Ball and stitch bonding
- Ultrasonic wedge bonding
- Wedge-wedge bonding
Bond wires
- Aluminum (18, 25, 33, 50 μm)
- Gold (20, 25, 33, 50 μm)
- Copper (25, 50 μm)
Equipment
- Kullicke & Soffa 4117 (Fine wire bonder)
- F&K Delvotec 53XX BDA [Manual combination bonder for Gold ball and deep access wedge (fine wire bonder)]
- F&K Delvotec 5450 (thick wire bonder)
- FS Bondtec 58xx Series (Automatic Fine wire bonder)