Fraunhofer Institute for Electronic Nano SystemsThe techniques for structuring of surfaces at Fraunhofer ENAS can be distinguished between nano- and microstructuring. In nanostructuring, structures with lateral dimensions in nanometer range (<1 µm) are created in various layers (e.g. Si, SiO2 or Al) with the help of a wide range of techniques. Structures of few micrometers until many hundred micrometers are created with microstructuring. Various technologies and standard equipment are available for both techniques.
Surface structuring
Nano structuring
At Fraunhofer ENAS, nanostructures are created by using nanoimprint lithography (NIL). High resolution Si-master wafers are produced externally by electron beam exposure. The Si-master wafers are impressed to polymer tools. With those replications positive imprints of the master wafer can be embossed into a nanometer thick photoresist layer which is hardened by ultraviolet light. Finally, these nanostructures can be transferred into various materials by dry etching.
Structurable materials
- Metals: Al
- Insulators: SiO2
- Semiconductors: Si
- Polymers: UV-photoresist (mrt-UVCur21, mrt-UVCur06), Ormostamp®
- Other materials upon request
Substrates
- Substrates up to 150 mm size
- Wafer
- Other round substrates (e.g. steel, ceramics)
Micro structuring
In microstructuring, polymeres or polymer layers are structured in micrometer range by photolithographic and imprinting methods. These structures can be transferred into various materials by wet chemical and dry etching.
Structurable materials
- Imprinting
- UV: Ormocere, photoresists
- Thermal: PMMA, photoresists
- Photo lithography
- Positive and negative resists
- Wet etching
- Metals: Al, Au, Cu, Pd, Sn, Pt, Ni
- Insulators: SiO2, SiN, TiN, TaN
- Semiconductors: Si
- Dry etching
- Metals: Al, Ta, Cu
- Insulators: SiO2, SiN, TiN, TaN
- Semiconductors: Si, Ge
- Other materials upon request
Substrates
- Substrates up to 150 mm size
- Wafer
- Other round substrates (e.g. steel, ceramics)