12. Fraunhofer Symposium in Sendai

12^th Fraunhofer Symposium in Sendai: Smart Integrated Systems for Different Applications

Honorary Symposium in Remembrance of Prof. Dr. Thomas Gessner

date: 24. November 2016

venue: Sendai Sunplaza Hotel

 

9.30 a.m.	Opening address Hideya Miki, Fraunhofer Representative Office Japan
Session 1:	Honorary speeches in remembrance of Prof. Geßner Prof. Kotani, Prof. Esashi, Prof. Otto, Susumu Kaminaga
10.30 a.m.	Break
Session 2:
10.40 a.m.	フラウンホーファー研究機構と日本代表部／Fraunhofer Gesellschaft and Fraunhofer Representative Office Japan Hideya Miki, Fraunhofer Representative Office Japan
11:10 a.m.	Smart Integrated Systems – Trends and Tendency Prof. Thomas Otto, Fraunhofer ENAS, Director
11:40 a.m.	Advanced Assembly and Integration Technologies for Miniaturized Electronic Systems Prof. Klaus- Dieter Lang, Fraunhofer IZM; Director
12.10 p.m.	Open collaboration with industry and one example Massive Parallel Electron Beam Write (MPEBW) Prof. Masayoshi Esashi,Tohoku University
12:40 p.m.	Lunch break
13:40 p.m.	Smart Sensors for Next Generation Robot Prof. Shuji Tanaka, Tohoku University
14:10 p.m.	Smart Production Systems Wolfgang Zorn, Fraunhofer IWU, Manager Group System Integration
14:40 p.m.	An Overview on Silicon Technologies, Devices and 3D Integration at Fraunhofer EMFT Munich Dr. Peter Ramm, Fraunhofer EMFT
15:10 p.m.	Break
15:30 p.m.	Expectations for MEMS technology on OMRON Healthcare products Toshiyuki Takahashi, OMRON
16:00 p.m.	Wafer level bonding technologies Prof. Joerg Froemel, Fraunhofer Project Center at WPI-AIMR
16:30 p.m.	Diamond-based devices fabricated by wafer-to-wafer bonding Dr. Vadim Lebedev, Fraunhofer IAF
17:00 p.m.	Flexural vibration mode nanodiamond/AlN disk resonators for mass sensing applications Taro Yoshikawa, Fraunhofer IAF
17:30 p.m.	End of Session 2
17:40 p.m.	Reception
Opening address	Prof. Thomas Otto, Fraunhofer ENAS
Closing address	Prof. Masayoshi Esashi, Tohoku University