12th Fraunhofer Symposium in Sendai: Smart Integrated Systems for Different Applications
Honorary Symposium in Remembrance of Prof. Dr. Thomas Gessner
date: 24. November 2016
venue: Sendai Sunplaza Hotel
9.30 a.m. | Opening address Hideya Miki, Fraunhofer Representative Office Japan |
Session 1: |
Honorary speeches in remembrance of Prof. Geßner Prof. Kotani, Prof. Esashi, Prof. Otto, Susumu Kaminaga |
10.30 a.m. | Break |
Session 2: |
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10.40 a.m. | フラウンホーファー研究機構と日本代表部/Fraunhofer Gesellschaft and Fraunhofer Representative Office Japan Hideya Miki, Fraunhofer Representative Office Japan |
11:10 a.m. | Smart Integrated Systems – Trends and Tendency Prof. Thomas Otto, Fraunhofer ENAS, Director |
11:40 a.m. | Advanced Assembly and Integration Technologies for Miniaturized Electronic Systems Prof. Klaus- Dieter Lang, Fraunhofer IZM; Director |
12.10 p.m. | Open collaboration with industry and one example Massive Parallel Electron Beam Write (MPEBW) Prof. Masayoshi Esashi,Tohoku University |
12:40 p.m. | Lunch break |
13:40 p.m. | Smart Sensors for Next Generation Robot Prof. Shuji Tanaka, Tohoku University |
14:10 p.m. | Smart Production Systems Wolfgang Zorn, Fraunhofer IWU, Manager Group System Integration |
14:40 p.m. | An Overview on Silicon Technologies, Devices and 3D Integration at Fraunhofer EMFT Munich Dr. Peter Ramm, Fraunhofer EMFT |
15:10 p.m. | Break |
15:30 p.m. | Expectations for MEMS technology on OMRON Healthcare products Toshiyuki Takahashi, OMRON |
16:00 p.m. | Wafer level bonding technologies Prof. Joerg Froemel, Fraunhofer Project Center at WPI-AIMR |
16:30 p.m. | Diamond-based devices fabricated by wafer-to-wafer bonding Dr. Vadim Lebedev, Fraunhofer IAF |
17:00 p.m. | Flexural vibration mode nanodiamond/AlN disk resonators for mass sensing applications Taro Yoshikawa, Fraunhofer IAF |
17:30 p.m. | End of Session 2 |
17:40 p.m. | Reception |
Opening address | Prof. Thomas Otto, Fraunhofer ENAS |
Closing address | Prof. Masayoshi Esashi, Tohoku University |