The focus of the applied research of department System Packaging are technologies both for the packaging of MEMS and NEMS in different packaging levels (wafer level, chip level, board level) and dimensions (2D, 3D) as well as for printing or micro- and nanostructuring of surfaces in microsystems technology. In addition to the standard wafer bonding methods such as silicon direct bonding, anodic, eutectic, adhesive and glass frit bonding also more novel wafer bonding methods such as laser assisted bonding, reactive bonding as well as low temperature and thermo-compression bonding are investigated and developed for specific fields of application. All wafer bonding techniques are characterized in terms of bonding quality, strength and hermiticity to ensure their suitability for certain applications.
3D / MEMS Packaging
Waferbonding | Chipbonding | Mechanical, electrical and thermal connections (TSV/TGV) | Flexible substrates and interposer | Wafer thinning and thin wafer handling