System Packaging

Research Field: Biocompatible Packaging

Smart, hybrid systems of micromechanical and microelectronic components have been shrinking in size for many years. Consequently, new fields of applications are also explored within medical technologies. Micromechanical accelerometers and inclination sensors as well as miniaturized electronic devices, which are currently being developed will become significant components of the next generation of medical implants. These systems provide the sophistication for monitoring the human organism in a new level, either in diversity and precision.

Along with this trend, the research work of Fraunhofer ENAS is addressing the issues associated with biocompatible housing for medical devices and integration of miniaturized systems while keeping their tiny dimensions. The focus is set on the selection, fabrication and characterization of suitable housing materials, either as homogeneous material or heterogeneous layer combination for an improved performance. The new deposition technologies are developed with respect to the properties of the device. This involves the designated field of application, taking into account maximum thresholds for applicable process temperatures as well as electromagnetic compatibility. The subsequent surface modification of the encapsulated device in a nanometre scale guarantees the adaption to different biological environments and allows for the desired immune response.

Due to its long experience in thin film deposition of metals, isolators and polymers, the site of Fraunhofer ENAS is confident to manage today’s and tomorrow’s challenges in biological packaging and integration.

Research content:

  • Reliable suppression of pathological interaction between organic and artificial system
  • Adaption of the technical system to the human body environment
  • Utilization of thin films to keep minimal package dimensions
  • Integration of sensor, housing, biological adaption and communication

Cells on silicon surface (Cooperation IFW Dresden)