System Packaging

Research Field: MEMS applications

Nowadays, micro and nano systems (MEMS/NEMS) are integrated in almost every high-tech or smart product. For example, miniaturized acceleration sensors prevent injuries or even help to prevent car accidents. Other MEMS devices monitor medical parameters, allow low cost communication or print high-precision color images. While the devices based on micro and nano systems have matured significantly over the last decade to become mainstream products, the packaging of these sensitive components and systems has not been addressed thoroughly. However, packaging plays an important role for the manufacturing costs and can also offer new possibilities of system integration. Also the integration of new materials in MEMS/NEMS can enhance their properties or reliability, create new functionalities or contribute to cost reduction and miniaturization.

For an efficient realization of MEMS/NEMS the packaging has to be part of the development from the very beginning. The department System Packaging is developing solutions for this approach, starting from zero level packaging on wafers up to module or board level packaging.

Capacitive micromachined ultrasonic transducer array

MEMS vibration sensors on wafer level