System Packaging

Research Field: 3D / MEMS Packaging

Fraunhofer ENAS is one of the worldwide leading institutes in the field of MEMS packaging on wafer and component level. The wafer level MEMS package has to be able to give access to desired media that should be measured (e.g. liquids, gases, light) while denying access to unwanted external influences. Those packaging technologies are not only applied to passive elements like inertial or gas sensors, but also in the area of active elements such as micromirrors and printing heads. With advancing system integration, also electronic components have to be integrated into the microsystem. For that reason the department System Packaging not only does research on hybrid integration on chip level but also on wafer level integration. For such a vertical stack one particularly has to pay attention to the impacts of individual bonding technologies (temperature, pressure) as well as to the electrical and thermal behavior of the system. Precise instruments and evaluation guidelines are available for characterizing and evaluating the technologies regarding hermeticity, strength and other values of interest.


Wafer with CuSn frames for SLID bonding


Al-Al wafer level thermocompression bonding


Hybrid integration on flexible substrate