Micro and Nanoelectronics

Electromagnetic and thermomechanic characterization and reliability evaluation

This topic addresses back-end of line components, chip-package interaction and reliability assessment of board and system level. Both, the thermomechanical reliability analysis and optimal layout for electronic components, devices and systems and simulative thermoelectrical reliability on a system (PCB) and package level, are addressed.

Application examples and scenarios


Automatized Measurement of Micromagnets on Wafer-Level in Close Distance


New possibilities for lifetime testing


Reliability optimization of innovative design techniques of power electronic systems


Combined experimental-numerical methods for thermo-mechanical system reliability


Thermomechanical reliability aspects of high temperature interconnects by transient liquid phase soldering


Multiscale residual stress analysis in thin film layers


Systemic and longterm effects on the reliability of soldered joints for future mobility


Parameter identification by nanoindenter


New simulation approach: reliability analysis applying CZM for 3D packages


High precision deformation measurements in multi-scale applications – a verification methodology for simulation-based reliability predictions


Measurement of intrinsic stresses using FIB equipment becomes a method of regular industrial practice


Longterm reliability testing under field conditions and evaluation of acceleration factors


Reliability optimization for the next generation of LED-based smart and comfortable lighting solutions