© Fraunhofer ENAS
Micro_and_Nanoelectronics_b

Micro and Nanoelectronics

Processes and technologies for micro and nanoelectronics
© Fraunhofer ENAS
Processes and technologies for micro and nanoelectronics

Processes and technologies for micro and nanoelectronics with the focus on back-end of line and interconnects

more info
Safety cap, developed during the project.
© Fraunhofer ENAS
Safety cap, developed during the project.

Packaging and (heterogeneous) integration (2D, 2.5D, 3D) for electronic devices

more info
© Fraunhofer ENAS
CMP Pressure distribution and padcontur

Modeling and simulation of technological processes, equipment and devices

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© Fraunhofer ENAS
RF Switch

Beyond CMOS and RF devices, integrated circuits and technologies

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© Fraunhofer ENAS
Nahfeldscanner

Electromagnetic and thermomechanic characterization and reliability evaluation

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Business Units

Micro and Nanoelectronics

Micro and nanoelectronics is one of the key enabling technologies of the 21st century. The ongoing downscaling (More Moore), the integration of different functionalities (More than Moore) as well as the development of possible future technologies beyond the CMOS scaling limits (Beyond CMOS) are the ongoing development trends. The business unit micro and nanoelectronics is focusing especially on the following topics:

 

Processes and technologies for micro and nanoelectronics with the focus on back-end of line and interconnects

Modeling and simulation of technological processes, equipment and devices

Beyond CMOS and RF devices, integrated circuits and technologies

Packaging and (heterogeneous) integration (2D, 2.5D, 3D) for electronic devices

Electromagnetic and thermomechanic characterization and reliability evaluation

 

Topics

 

Processes and technologies for micro and nanoelectronics with the focus on back-end of line and interconnects

 

Modeling and simulation of technological processes, equipment and devices

 

Beyond CMOS and RF devices, integrated circuits and technologies

 

Packaging and (heterogeneous) integration (2D, 2.5D, 3D) for electronic devices

 

Electromagnetic and thermomechanic characterization and reliability evaluation