Die Smart Systems Integration Conference SSI 2013 findet statt vom 13.-14. März 2013 in Amsterdam. Im Vorfeld der Conference findet der 2. Europäische Executive Congress der MEMS Industry Group statt.

Die SSI 2013 adressiert die Themen:

  • Smart systems for automotive applications / green car and aeronautics
  • Smart medtech systems and systems for prognostics health management
  • Smart systems in logistics and security applications
  • Smart power, smart grids and smart networks
  • Cyber physical systems, smart communication, self-sufficient sensor networks
  • Manufacturing technologies for smart integrated system
  • Design of smart systems, component design, design for reliability
  • Micro and nano systems / embedded systems
  • Advanced micro and nano technologies
  • New materials, nano structures and devices
  • Roll to roll technologies, printed functionalities
  • 3D integration and interconnect technologies
  • System integration and packaging
  • Test and reliability of components and systems

Der Call For Paper schließt am 19.Oktober 2012. Avisierte late abstracts können bis zum 28. Oktober eingereicht werden.

Für weitere Informationen:

http://www.mesago.de/de/SSI/ home.htm

Oder kontaktieren Sie den Conference-Chair:
Prof. Dr. Thomas Geßner unter info.enas.fraunhofer.de



Mittwoch, 13. März 2013

8:45 Uhr
Prof. Dr. Thomas Gessner
Conference Chair, Fraunhofer ENAS
Paris Charles de Gaulle 2+3

10:45 - 11:10 Uhr
"Advances in Reliability Research by Means of Crack Avoidance Strategy"
Prof. Bernd Michel, Fraunhofer ENAS
London Heathrow 6

11:35 - 12:00 Uhr
"Low temperature wafer bonding technology for RF based MEMS devices"
Marco Haubold, Fraunhofer ENAS
London Heathrow 3

12:00 - 12:25 Uhr
"Wafer-level technology for piezoresistive electro-mechanical transducer based on Carbon Nanotubes"
Dr. Sascha Hermann, Fraunhofer ENAS
London Heathrow 6

14:45 - 15:10 Uhr
"Vertical Integration techniques for MEMS devices using high-AR TSV"
Lutz Hofmann, Fraunhofer ENAS
London Heathrow 3


"Picosecond Laser Micromachining in the context of MEMS/NEMS applications"
Tom Enderlein, Technische Universität Chemnitz

"Actuator net design for morphing wing structure"
André Gratias, Fraunhofer ENAS

"Studies on the piezoresistive effect in MOS transistors for use in integrated MEMS sensors"
Sven Haas, Technische Universität Chemnitz

"System Design of Double Wall Synthetic Jet Actuators"
Mathias Lipowski, Fraunhofer ENAS

"Influence of DMSO and MWCNTs addition on the thermoelectric properties of PEDOT:PSS Thin Films"
Jinji Luo, Technische Universität Chemnitz

"Laterally stracked organic devices fabricated by trench technology"
Dr. Danny Reuter, Technische Universität Chemnitz

"Package Characterization with Stress Chip Measurement for Health Monitoring"
Florian Schindler-Saefkow, Fraunhofer ENAS

"Joint Technology Initiative Clean Sky - Aims for greener Aviation"
Martin Schüller, Fraunhofer ENAS

"Optimization of MEMS/NEMS for reliable resonance frequencies"
Chris Stöckel, Fraunhofer ENAS

"Adaped printed battery development for driving a smart miniaturised cholesterol sensing system"
Dr. Andreas Willert, Fraunhofer ENAS