Micro and Nanoelectronics

Processes and Technologies for Micro and Nanoelectronics

The mission of Nano Process Integration at Fraunhofer ENAS is to combine various individual processes of micro- and nanotechnologies, including new types of materials or complex multilayer stacks with dimensions down to the sub-nanometer range, into an application specific and reliable technology.

Application examples and scenarios


New characterization opportunities for surface processing


In situ plasma diagnostics for 7 nm etching processes


Barrier and Metal Chemical Vapor Deposition (CVD) – UPDATE coming


Atomic Layer Deposition (ALD)


Characterization of copper alloys for self-forming barrier applications


Technologies for Spintronics