Processes and technologies for micro and nanoelectronics
© Fraunhofer ENAS
Processes and technologies for micro and nanoelectronics

Processes and technologies for micro and nanoelectronics

Micro and Nanoelectronics

Processes and Technologies for Micro and Nanoelectronics

The mission of Nano Process Integration at Fraunhofer ENAS is to combine various individual processes of micro- and nanotechnologies, including new types of materials or complex multilayer stacks with dimensions down to the sub-nanometer range, into an application specific and reliable technology.

Application examples and scenarios

 

New characterization opportunities for surface processing

 

In situ plasma diagnostics for 7 nm etching processes

 

Barrier and Metal Chemical Vapor Deposition (CVD) – UPDATE coming

 

Atomic Layer Deposition (ALD)

 

Characterization of copper alloys for self-forming barrier applications

 

Technologies for Spintronics