Our Range of Services to Support Your Success
- Development of complex systems, including electronics for actuation and detection, communication, and energy and data transfer
- Development of MEMS, Beyond CMOS, quantum, electronic, and photonic components, as well as edge AI solutions for data processing and analysis
- Printed large-area electronics and printed functional layers beyond the wafer level
- Functional integration (hardware, software)
- Development of functional prototypes, demonstrators, and small batches
Our Core Competencies to Help You Overcome Your Challenges
- Development of complex systems, including electronics for actuation and detection, communication, and energy and data transfer for:
- Inertial sensors (e.g., acceleration, vibration, and angular rate)
- Wireless multi-sensor technology
- Optical and imaging systems (e.g., for hyperspectral imaging, optical coherence tomography (OCT), and spectroscopy)
- xMR and memristive sensor systems
- Lab-on-chip diagnostics (e.g., microfluidics, biosensing)
- Miniaturized ultrasonic transducers (PMUT and CMUT)
- Development of MEMS (e.g., sensors, actuators, resonators, and ultrasonic transducers) and Beyond CMOS, quantum, and photonic components
- Edge AI solutions for data analysis and evaluation
- Printed electronics and printed functional layers beyond the wafer level
- Development of printed, flexible, and hybrid electronics on 2D and 3D substrates or roll-to-roll, and robot-assisted printing using inkjet, screen printing, and dispensing
- Customer-specific fabrication of inkjet inks (e.g., nanoparticle-based)
- Investigation of the manufacturing of chemically active printed layers, such as anodes and cathodes for CCM fuel cells and electrolyzers
- Functional integration
Our Research Topics for Future Innovations
- Design, fabrication, and characterization of printed, flexible, and hybrid electronics (fabrication of printed functional layers and printed functionalities such as CCM/MEA, conductive traces, wiring harness segments, electrodes, antennas, batteries, sensors, resistors, transistors, capacitors, diodes, protective layers, etc.)
- Design, fabrication, and characterization of chemically active printed surfaces and layers
- Development of multi-sensor systems (soil moisture, acoustics, ultrasonic, inertial, energy harvesting, low-power, wireless, structurally integrated – with commercially available sensors as well as in-house developments), including near-sensor data processing
- Development of hydrogen sensor technology for structural monitoring / multi-sensor systems for hydrogen transport and storage
- Development of inertial sensor technology (in particular angular rate sensors and acceleration sensors, vibration sensors, IMU)
- Optimization of performance and development of new functionalities for piezo-MEMS for PMUTs, piezoelectric actuators, and zero-energy sensor technology
- Capacitive ultrasonic transducers (CMUTs): further development, use of the technology in additional application areas, and investigation of other microacoustic devices (e.g., SAW)
- Development and fabrication of hydrogen sensors with a focus on H2 sensor layers, hydrogen barriers, and miniaturized sensor systems for safety-critical applications (low hydrogen concentrations, i.e., leakage)
- Wireless sensor technology, data and energy transfer for customer-specific applications (Wireless Solutions)
- Design and characterization of PIF – photonic integrated functionalities
- Design, development, and characterization of spectral sensor technology (Fabry-Pérot filters, mechanical actuators, QD-LEDs)
- Design, development, and characterization of single-photon and photon-pair sources for quantum technology applications
- Design, development, and characterization of piezoelectric ultrasonic transducers (PMUTs), including electronics design
- Design, development, and characterization of capacitive ultrasonic transducers (CMUTs), including electronics design
- Alkaline electrolysis and fuel cells (AEM – anion exchange membrane) as a subtopic within the design, fabrication, and characterization of chemically active printed surfaces and layers
- Roll-to-roll small-batch production (inkjet, screen printing); sheet-based production starting from quantity 1 (inkjet); sheet-based small-batch production (screen printing); printing on various 3D objects (inkjet) starting from quantity 1
- Use of AI on microcontrollers (µC) and/or FPGAs
- Computational (spectral) imaging
- Development of integrated, multimodal sensor technology into microfluidics for food analytics in the field of (food and food production)
- Development of integrated, multimodal sensor technology into microfluidics for veterinary diagnostics
- Development of integrated, multimodal sensor technology into wearables for human, body-worn sensor and actuation technology
- Sensor integration in organ-on-chip models
- DNA origami for various sensor applications
Fraunhofer Institute for Electronic Nano Systems