Our Range of Services to Support Your Success
- Development of test solutions at the wafer, chip, and component level for MEMS, Beyond CMOS, quantum, electronic, and photonic components
- Material characterization
- Thermo-mechanical and electrical reliability assessment, as well as Prognostic Health Management (PHM), including the prediction of the system state
- Method development, including validation
- Service for functional prototypes, demonstrators, and small batches
Our Core Competencies to Help You Overcome Your Challenges
- Tests at the wafer, chip, and component level
- Electrical tests (functional, burn-in, and performance tests)
- Optical tests using an optical probe station for photonic integrated circuits from UV to MIR
- Magnetic tests for MRAM and magnetic sensors
- Electromagnetic tests (high-frequency testing, near-field measurements up to 140 GHz, and failure analysis)
- MEMS testing (C, V, I, f0, Q, and specific parameters) and motion analysis
- Acoustic testing for micromechanical ultrasonic transducers (MUTs) and acoustic components
- Sensor system calibration
- Reliability assessments
- Service-life tests in accordance with standards such as JEDEC/AQG (temperature, humidity, power-cycle, and vibration testing – each combinable), covering in particular the temperature range from 4–700 K
- Environmental testing (temperature, humidity)
- Field-like long-term and stress testing
- 3D deformation and physical failure analysis using methods such as VIS, UV, EDX, EBSD, FIB, and X-ray tomography
- Design for Reliability, including the development of material models for finite-element calculations and experimental analysis
- Prognostic Health Management (PHM), including the prediction of the system state
- Method development, including validation
- Test programs for component and system testing
- Virtual tests and analyses for process control, failure analysis, reliability, and condition monitoring using AI and digital twins
- Integration of static and dynamic testing for high-power semiconductor products, in particular SiC and GaN at the wafer level
Our Research Topics for Future Innovations
- Reliability assessment of electronics (from components to systems) using stress-based models for end-of-life under test and operating conditions
- Methods for in-situ monitoring of thermo-mechanical degradation using early-warning indicators and data trends to estimate remaining useful life (RUL)
- Design and technology verification, as well as characterization and calibration, to ensure the functionality of: optical materials and components; MEMS at the wafer level and component level; sensor systems
- Near-field measurement technology for EMC and EM characterization of electronic modules
- Development of a wafer-level power-test system
- Quantum technology: material characterization and thermo-mechanical reliability of packaging and interconnection technology (AVT – Aufbau- und Verbindungstechnik)
- EMC considerations for assessing the remaining service life of electronic components for a sustainable circular economy
- Chiplet test (Built-In Self-Test)
- Application Lab (services for industrial customers)
Fraunhofer Institute for Electronic Nano Systems