Fraunhofer Institute for Electronic Nano Systems
Fraunhofer Institute for Electronic Nano Systems
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Design, Simulation, and Digital Models for Semiconductor Processes and Devices up to the System Level

Research Focus

Our Range of Services to Support Your Success

  • Simulation of semiconductor processes
  • Knowledge-based and data-driven models of semiconductor processes
  • Material models for optics and electronics
  • Design and layout of components and systems (MEMS, Beyond CMOS, quantum and photonics, electronics)
  • Simulation for reliability assessments of electronic assemblies and systems
  • Design for Test (DfT) and Design for Reliability (DfR)

Our Core Competencies to Help You Overcome Your Challenges

  • Atomistic and continuum-based material modeling expertise for optics and electronics (e.g., metamaterials, nanomaterials)
  • Design and simulation expertise in microsystems engineering and microelectronics
    • Layout and design of MEMS, Beyond CMOS, quantum, electronic, and photonic components and systems
    • System and electronics design and simulation
    • EMC simulations for electronic components and systems
    • Models for simulation (FEM, lumped elements, multiphysics, electrical, optical)
  • Simulation expertise supported by strong technological competence in semiconductor processes
    • Physics-based models for virtual prototyping in semiconductor technology and nanotechnology
    • Process models and material models, especially for thin-film technologies
    • Knowledge-based process models derived from data, knowledge, models, and AI
    • Fast digital models enabled by expertise in AI, numerical methods, and high-performance computing
  • Expertise in thermo-mechanical reliability assessment
    • Design and construction of equipment for efficient testing of the electro-thermo-mechanical reliability of electronic assemblies and systems
    • Investigation of the thermo-mechanical degradation mechanisms that are fundamentally responsible for failures in electronic components and systems
    • Modeling of degradation processes using advanced concepts from fracture mechanics and damage mechanics
    • Quantification and modeling of the progression of damage over time in electronic assemblies and systems to enable precise service life prediction
    • Development of experimentally validated simulation methods for optimizing the design of new products and for in-situ monitoring of electronics reliability during operation
    • Development of compact models and digital twins for the reliability assessment of electronic assemblies and systems across the entire value chain

Our Research Topics for Future Innovations

  • Design and implementation of knowledge-enhanced process models
  • Use of heterogeneous platforms for AI acceleration
  • Prediction of test and measurement results using complex data-driven models
  • FAST modeling (Flexible, Appropriate, Structured, Transparent) of the electro-thermo-mechanical behavior of electronic components and systems
  • DfR simulation of electro-thermo-mechanical reliability along the value chain (methodological approach: compact models)
  • Compact digital twins for implementation in ECS and in full-system simulations (e.g., automotive, robotics, power plants)
  • Simulation of semiconductor technology processes
  • Simulation of materials in semiconductor technology and of nanodevices
  • Simulations for the development of new energy storage materials
  • Process models for sustainability analysis of production cycles
  • Design and mask services for MEMS and MOEMS components and nanodevices
  • PCM structures for process control
  • PHM: Hierarchical system of hybrid models (Hierarchy: system « feature / Hybrid: PoF & data-driven approach)