| Wednesday | MaY 6, 2026 | 12.30 - 9.00 pm |
| 12.30 – 12.50 pm |
Welcome
(Prof. Dr. Harald Kuhn and Dr. Maik Wiemer, Fraunhofer ENAS) |
| 12.50 - 1.00 pm |
Opener
Automotive Industry Trends and Opportunities
(Nihat Küçük, Motherson Innovations Deutschland GmbH) |
| Session 1: Devices |
| 1.20 – 1.55 pm |
Next-Generation Optical Sensing: Broadcom’s IFPD - Product and Packaging Portfolio
(Frank Becker, Broadcom) |
| 1.55 – 2.20 pm |
Ultrasound-Based Sensing Systems: From Human–Machine Interfaces to Microelectronic Inspection
(J.-Prof. Dr.-Ing. Christian Kupsch, TU Bergakademie Freiberg)
|
| 2.20 – 2.45 pm |
Reverse Engineering and Failure Analysis with Ion Beam Etching
(Stefanie Rumbke, scia Systems GmbH) |
| 2.45 – 3.15 pm |
Coffee break |
| Session 2: Additive technologies |
| 3.15 – 3.40 pm |
Inkjet additive processes in semiconductor manufacturing
(Dr. Kai Keller, Notion Systems GmbH) |
| 3.40 – 4.05 pm |
Packaging everything everywhere. Advantages and challenges in AM-integrated electronics
(Florens Wasserfall, Kronos) |
| 4.05 – 4.30 pm |
Micro Transfer Printing: an overview on application to integrated photonics
(Dr. Ruggero Loi, X-Celeprint) |
| 4.30 – 4.55 pm |
Two-Photon Polymerization (2PP) - Availabe Technology at Fraunhofer ENAS
(Valeri Fitz, Fraunhofer ENAS) |
| 4.55 – 5.30 pm |
Coffee break |
| 5.30 – 6.00 pm |
Idea Pitches
|
| 6.00 – 9.00 pm |
Get together / Networking |
| Thursday | May 7, 2026 | 9:00 am - 3.30 pm |
| 9.00 – 9.10 am |
Welcome
(Dr. Maik Wiemer, Fraunhofer ENAS) |
| 9.10 – 9.40 am |
Opener
From Foundry to Customer Application: Supply Chain and Packaging in a Fabless ASIC Business Model
(Dr. Detlef Billep, EDC Electronic Design Chemnitz GmbH) |
| Session 3: Process technologies |
| 9.40 – 10.05 am |
Progress in Al-plating and bi-/multilayer stacking with Almight® & MeltMatic®
(Mike Becker, NB Technologies GmbH) |
| 10.05 – 10.30 am |
Metallizations and solder joints from the perspective of a materials scientist
(Dr.-Ing. Martin Seyring, Hochschule Schmalkalden) |
| 10.30 – 11.00 am |
Coffee break |
| Session 4: Bonding technologies |
| 11.00 – 11.25 am |
Die-2-Wafer Bonding - Recent Advances and Challenges for Heterogenous Integration
(Tobias Wernicke, EV Group) |
| 11.25 – 11.50 am |
Fluxless thermo-compression bonding for high density integration
(Dr. Martin Kainz, Besi) |
| 11.50 am – 12.15 pm |
tbc
(Harry Chou, PulseForge) |
| 12.15 – 1.15 pm |
Lunch break |
| 1.15 – 1.40 pm |
Characterization of Electroplated Barrier Metals for Advanced Packaging
(Dr. Tsvetina Dobrovolska, Umicore Galvanotechnik GmbH) |
| 1.40 – 2.05 pm |
Surface-activated bonding of amorphous wafer substrates at room temperature via Al2O3 atomic-level contact formation
(Alexander Spatzig, Nidec Drive Technology Europe GmbH - Machine Tool Division) |
| 2.05 – 2.30 pm |
Beyond Conventional Bonding: Laser-Assisted Interconnect Solutions for Next-Generation Electronic Packaging
(Dr. Clemens Wesseling, Pac Tech - Packaging Technologies GmbH) |
| 2.30 – 2.40 pm |
Conclusion
(Dr. Maik Wiemer, Fraunhofer ENAS) |
| 2.45 – 3.30 pm |
Individual lab tours |
Fraunhofer Institute for Electronic Nano Systems