Our Range of Services to Support Your Success
- Processes and process chains in semiconductor technologies, in particular:
- Development and optimization of individual processes, including the integration of new materials
- Generic and customer-specific technology modules for device development
- Technology platforms for MEMS/NEMS, MOEMS, and photonics
- Fabrication of functional prototypes, demonstrators, and small batches
Our Core Competencies to Help You Overcome Your Challenges
- Provision of leading-edge processes with sustainability considerations in the areas of WET, CMP, lithography, plasma etch, CVD, and PVD on 150 mm and 200 mm substrates for the technologies mentioned above and more
- Customer-specific developments for individualized integration requirements, for example for hybrid bonding, integration of phase-change materials, or integration of 1D/2D materials (CNT) at the wafer level, including the associated nanoanalytics
- Deposition of insulator materials and metals on 3D structures (e.g., TSV) with high to very high aspect ratios
- Deposition and patterning of spintronic or optical multilayer stacks
- Grayscale lithography using electron beam and i-line wafer steppers for 3D structures
Our Research Topics for Future Innovations
- Technology modules (materials, processes and integration) for MEMS/NEMS, MOEMS
- Technology modules (materials, processes, and integration) for xMR sensors (xMR = TMR or GMR)
- Technology modules (materials, processes, and integration) for the hetero-integration of quantum devices
- Technology modules (materials, processes, and integration) and device development for CNT- and graphene-based 1D/2D nanostructures
- Technology modules (materials, processes, and integration) for photonic devices
- Atomic layer processes
- Process development and optimization using machine learning (e.g., plasma etch)
- Nanostructuring of thin films for the fabrication of optical functions and quantum devices
- Characterization of bond interfaces at the wafer, chip, and component levels
- Development of memristor technologies for neuromorphic computing
- Fabrication of 3D structures using grayscale lithography and thick photoresist systems; also suitable for high topographies
- Development of sustainable unit processes, for example through evaluating halogen-free etching gases
- Processing of customer-specific wafer technologies and processes as part of pilot and small-batch production
- Thermoforming of parylene for functional microstructures for optical, microfluidic, or medical applications
Fraunhofer Institute for Electronic Nano Systems