Workshop  /  September 02, 2026  -  September 03, 2026

Test and Reliability between Ice and Fire: New Labs and Methods from 4 K up to 700 K.

The opening of the "Cryo-Lab for Materials and Electronics Packaging" (CRYME), which is located in the Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), will take place on September 2, 2026.

The Chemnitz Seminar offers you two days of outstanding presentations on reliability and testing methods from cryogenic to high-temperature conditions. Take advantage of this excellent platform for knowledge exchange, discussion of practical applications, and identifying future collaboration opportunities.

Seminar highlights:

  • Opening of the “CryoLab for Materials and Electronics Packaging” at the MAIN building of Chemnitz University of Technology
  • Research and application examples in cryoelectronics and quantum technology - from science to industry
  • Burn-in tests and reliability assessment for advanced packaging technologies